论文信息 - Fine Keyed Alignment and Bonding for Wafer-Level 3D ICs - 字舞流文

Fine Keyed Alignment and Bonding for Wafer-Level 3D ICs

Precise wafer-to-wafer alignment accuracy is crucial to interconnecting circuits on different wafers in three dimensional integrated circuits. We discuss the use of fabricated structures on wafer s ...

Jian-Qiang Lu | Ronald J. Gutmann | Frank Niklaus | Timothy S. Cale | Sang Hwui Lee | Ravi J. Kumar | Hui-Feng Li | J. Yu | J. J. McMahon

[1] Peter Enoksson,et al. A method to maintain wafer alignment precision during adhesive wafer bonding , 2003 .

[2] Göran Stemme,et al. Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels , 2001 .

[3] S. D. Collins,et al. A wafer-to-wafer alignment technique , 1989 .

[4] Jian-Qiang Lu,et al. Adhesive wafer bonding using partially cured benzocyclobutene for three-dimensional integration , 2006 .

[5] J. Oberhammer,et al. Sealing of adhesive bonded devices on wafer level , 2004 .

[6] G. Stemme,et al. Low temperature full wafer adhesive bonding , 2001 .

[7] Alexander H. Slocum,et al. Precision passive mechanical alignment of wafers , 2003 .

[8] C. M. Sotomayor Torres,et al. Nanoimprint lithography: challenges and prospects , 2001 .

[9] P. Vettiger,et al. Wafer-scale microdevice transfer/interconnect: its application in an AFM-based data-storage system , 2004, Journal of Microelectromechanical Systems.