Design and experimental verification of power packet generation system for power packet dispatching system

Power packetization in a power distribution line is discussed in this paper. The packet consists of electric power and an information tag superimposed on its voltage waveform. Here a power packet generation system is designed by utilizing a design method of dynamic quantizer for discrete-valued signal. The implementation of the power packet generation system is mainly discussed, with evaluating the performance of the system based on experimental results.

[1]  Okabe Yasuo,et al.  Quality-aware Energy Routing toward On-demand Home Energy Networking , 2010 .

[2]  Takashi Hikihara,et al.  Estimation of Power Packet Transfer Properties on Indoor Power Line Channel , 2012 .

[3]  Takashi Hikihara,et al.  AC Power Routing System in Home Based on Demand and Supply Utilizing Distributed Power Sources , 2011 .

[4]  Shun-ichi Azuma,et al.  Optimal dynamic quantizers for discrete-valued input control , 2008, Autom..

[5]  Takashi Hikihara,et al.  In-Home Power Distribution Systems by Circuit Switching and Power Packet Dispatching , 2010, 2010 First IEEE International Conference on Smart Grid Communications.

[6]  Takashi Hikihara,et al.  Feasibility of power packet dispatching at in-home DC distribution network , 2012, 2012 IEEE Third International Conference on Smart Grid Communications (SmartGridComm).

[7]  Junichi Toyoda,et al.  Proposal of an open-electric-energy-network (OEEN) to realize cooperative operations of IOU and IPP , 1998, Proceedings of EMPD '98. 1998 International Conference on Energy Management and Power Delivery (Cat. No.98EX137).

[8]  Yasuo Okabe,et al.  Quality-aware energy routing toward on-demand home energy networking: (Position paper) , 2011, 2011 IEEE Consumer Communications and Networking Conference (CCNC).

[9]  S.R. Sanders,et al.  An Architecture for Local Energy Generation, Distribution, and Sharing , 2008, 2008 IEEE Energy 2030 Conference.

[10]  H. Mantooth,et al.  Power Conversion With SiC Devices at Extremely High Ambient Temperatures , 2007, IEEE Transactions on Power Electronics.