Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics packaging

Abstract It is indicated that the impact and deflection of overhang die during overhang bounding process results in considerable impact of performance of bonding in this paper. Specifically, the deflection is unstable and up to 27 μm for the given parameters, which results in low shear force strength and low success rate of overhang bonding. To improve the performance of the overhang bonding, an effective and novel approach, overhang bonding with thick Al, is presented. The approach decreases hardness of bonding die, which makes the bonding die more compliant during bonding process than that in the traditional approach, thus the shear strength and bonding success rate of overhang bonding will be improved. Finally, effects of ultrasonic and force to overhang bonding indicates that excessively low or excessively high ultrasonic power results in weak bonding performances, and so did the force.

[1]  Z. W. Zhong,et al.  Overview of wire bonding using copper wire or insulated wire , 2011, Microelectron. Reliab..

[2]  Jiromaru Tsujino,et al.  Welding characteristics and temperature rise of high frequency and complex vibration ultrasonic wire bonding , 1998 .

[3]  Insu Jeon,et al.  The study on failure mechanisms of bond pad metal peeling: Part B--Numerical analysis , 2003, Microelectron. Reliab..

[4]  Jianmin Qu,et al.  Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness , 2002 .

[5]  Yi-Ming Jen,et al.  Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages , 2006, Microelectron. Reliab..

[6]  Vadim V. Silberschmidt,et al.  A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads , 2009 .

[7]  Narasimalu Srikanth,et al.  Critical study of thermosonic copper ball bonding , 2004 .

[8]  J. Qu,et al.  8.06 – Thermomechanical Reliability of Microelectronic Packaging , 2003 .

[9]  Yong Ding,et al.  Effects of bonding force on contact pressure and frictional energy in wire bonding , 2006, Microelectron. Reliab..

[10]  G. Harman,et al.  The Ultrasonic Welding Mechanism as Applied to Aluminum-and Gold-Wire Bonding in Microelectronics , 1977 .

[11]  Samihah Abdullah,et al.  LOW LOOPING CHALLENGES IN THE QFN WIRE BONDING PROCESS , 2008 .

[12]  Tsujino,et al.  High-frequency ultrasonic wire bonding systems , 2000, Ultrasonics.

[13]  Deok-Hoon Kim,et al.  A novel robust and low cost chips package and its thermal performance , 2000 .

[14]  A. Jalar,et al.  Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping , 2006, IEEE Transactions on Electronics Packaging Manufacturing.

[15]  Kyung-Wook Paik,et al.  Development of three-dimensional memory die stack packages using polymer insulated sidewall technique , 2000 .

[16]  G. Harman,et al.  Wire bonding-towards 6- sigma yield and fine pitch , 1992 .

[17]  Vadim V. Silberschmidt,et al.  Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads , 2010 .

[18]  Insu Jeon,et al.  The study on failure mechanisms of bond pad metal peeling: Part A--Experimental investigation , 2003, Microelectron. Reliab..

[19]  J. Wei,et al.  Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution , 2011, Microelectron. Reliab..

[20]  G. Harman.  Acoustic-Emission-Monitored Tests for TAB Inner Lead Bond Quality , 1982 .

[21]  G.G. Harman.  Wire bonding-toward 6 sigma yield and fine pitch , 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

[22]  K. M. Chen,et al.  Reliability Evaluation of BOAC and Normal Pad Stacked-Chip Packaging Using 90nm Low-K Wafers , 2006, 2006 International Conference on Electronic Materials and Packaging.

[23]  Wang Fuliang,et al.  Theoretical and experimental analyses of atom diffusion characteristics on wire bonding interfaces , 2008 .

[24]  T. Y. Lin,et al.  Improving the deflection of wire bonds in stacked chip scale package (CSP) , 2003, Microelectron. Reliab..

[25]  Donghyun Kim,et al.  A novel robust and low cost stack chips package and its thermal performance , 2000, ECTC 2000.