Prediction of Liquid Formation for Solder and Non-Solder Mask Defined Array Packages
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[1] Stephen M. Heinrich,et al. Prediction of Solder Joint Geometries in Array-Type Interconnects , 1996 .
[2] Peter Borgesen,et al. Shape of a nonaxisymmetric liquid solder drop constrained by parallel plates , 1993 .
[3] A. J. Rafanelli. Solder Fillet Height Criteria for Surface Mounted Chip Components , 1989 .
[4] Lewis S. Goldmann,et al. Geometric optimization of controlled collapse interconnections , 1969 .
[5] Kuo-Ning Chiang,et al. Electronic packaging reflow shape prediction for the solder mask defined ball grid array , 1998 .
[6] K. Brakke,et al. Computer Simulation of Solder Bridging Phenomena , 1996 .
[7] W. T. Pimbley,et al. Shape and Force Relationships for Molten Axisymmetric Solder Connections , 1992 .
[8] H. K. Charles,et al. Solder Joint Reliability — Design Implications From Finite Element Modeling and Experimental Testing , 1990 .
[9] L. Racz,et al. Determination of Equilibrium Shapes and Optimal Volume of Solder Droplets in the Assembly of Surface Mounted Integrated Circuits. , 1993 .
[10] M. K. Shah,et al. Analysis of Parameters Influencing Stresses in the Solder Joints of Leadless Chip Capacitors , 1990 .
[11] R. Satoh,et al. Optimum Bonding Shape Control of Micro-solder Joint of IC and LSI , 1987 .