Studies of cure schedule and final property relationships of a commercial epoxy resin using modified imidazole curing agents

Abstract A commercial epoxy prepolymer (MY750) was cured with novel modified imidazole curing agents under both isothermal and dynamic scanning conditions. The thermal behaviour of the formulated mixtures was investigated using differential scanning calorimetry and thermogravimetric analysis, and glass transition temperature (Tg) values derived for polymers resulting from both cure schedules. Tg values and the thermal stability of polymers arising from the isothermal cure schedules were generally higher than those for the corresponding dynamic cure. For samples cured by the dynamic curing process, a lower heating rate resulted in higher Tg values and superior thermal stability. The same findings were obtained for samples cured by the isothermal curing process when the relatively low initial cure temperatures were optimal. The results of this study indicate that the initial and post-cure conditions may affect the final properties, and support the view that both the initial and post-cure schedules are of critical importance in governing the nature of the early network formation and the final network structure.

[1]  John R. Jones,et al.  Preparation of metal-aromatic diamine complexes and their influence on the cure of a commericial epoxy resin , 1996 .

[2]  J. Mijovic,et al.  Etherification reaction in epoxy-amine systems at high temperature , 1994 .

[3]  John R. Jones,et al.  Effect of complexation with copper (II) on cured neat resin properties of a commercial epoxy resin using modified imidazole curing agents , 1996 .

[4]  John R. Jones,et al.  Studies of temperature and time-dependent network formation in commercial epoxy resins using modified imidazole curing agents , 1996 .

[5]  Jovan Mijovic,et al.  The effect of stoichiometry and thermal history during cure on structure and properties of epoxy networks , 1995 .

[6]  W. Chang,et al.  Imidazole Complexes as Hardeners for Epoxy Adhesives , 1971 .

[7]  G. Martin,et al.  Curing mechanism and thermal properties of epoxy-imidazole systems , 1989 .

[8]  Brendan J. Howlin,et al.  High temperature 1H NMR studies of epoxy cure: A neglected technique , 1994 .

[9]  John R. Jones,et al.  The development of controllable metal-chelate curing agents with improved storage stability , 1994 .

[10]  John R. Jones,et al.  Preparation and characterization of imidazole–metal complexes and evaluation of cured epoxy networks , 1994 .

[11]  Shu-Shing Chang,et al.  Effect of curing history on ultimate glass transition temperature and network structure of crosslinking polymers , 1992 .

[12]  Bryan Ellis,et al.  Chemistry and technology of epoxy resins , 1992 .

[13]  John R. Jones,et al.  Comparative kinetic analyses for epoxy resins cured with imidazole–metal complexes , 1994 .