论文信息 - Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip - 字舞流文

Vertical-cavity surface-emitting laser flip-chip bonding to silicon photonics chip

We demonstrate the integration of vertical-cavity surface-emitting lasers (VCSELs) with silicon photonics chip using flip-chip bonding technique, with bidirectional vertical-coupled grating coupler for light coupling.

Nicolas A. F. Jaeger | Ashok V. Krishnamoorthy | Xuezhe Zheng | Jin Yao | John E. Cunningham | Lukas Chrostowski | Markus-Christian Amann | Richard Bojko | Yun Wang | L. Chrostowski | M. Amann | J. Cunningham | A. Krishnamoorthy | Xuezhe Zheng | Jin Yao | N. Jaeger | R. Bojko | M. Muller | Yun Wang | Michael Muller | Stevan S. Djordjecvic

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