Quasi-3D Thermal Model of Stacked IC-TSV-BGA Package

3D chip stacking technology is now an available option to increase the effective performance of functional modules. Several attempts were made to model the temperature distribution in multichip module packages using universal 3D simulators ABAQUS, FloTHERM, ANSYS, and others. However fully 3D CFD and/or FEA models have some lacks for practical engineers: 1) complex I/O data description; 2) unacceptable CPU time. Quasi-3D approach is an efficient means to obtain an accurate solution with acceptable CPU time. In this work a quasi-3D approach which was previously used for different types of BGA packages is adapted to the new 3D IC-TSV-BGA package constructions.

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