论文信息 - Thermomechanical stress in GaN‐LEDs soldered onto Cu substrates studied using finite element method and Raman spectroscopy - 字舞流文

Thermomechanical stress in GaN‐LEDs soldered onto Cu substrates studied using finite element method and Raman spectroscopy

Sri Krishna Bhogaraju | B. Wunderle | G. Elger | D. Pedron | R. Signorini | F. Conti | E. Liu