Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding
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Michael Mayer | Jeong-Tak Moon | A. Pequegnat | John Persic | M. Mayer | C. Hang | Y. Zhou | A. Pequegnat | Y. Zhou | C. J. Hang | J. Moon | J. Persic
[1] Michael Mayer,et al. Microstructural study of copper free air balls in thermosonic wire bonding , 2008 .
[2] Michael Mayer,et al. Bonding wire characterization using automatic deformability measurement , 2008 .
[3] Michael Mayer,et al. In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding , 2008 .
[4] Z. Zhong,et al. Study of factors affecting the hardness of ball bonds in copper wire bonding , 2007 .
[5] Y. Zhou,et al. Microjoining and Nanojoining , 2008 .
[6] B. Langenecker. Effects of Ultrasound on Deformation Characteristics of Metals , 1966, IEEE Transactions on Sonics and Ultrasonics.
[7] M. Mayer,et al. Reduction of underpad stress in thermosonic copper ball bonding , 2008, 2008 58th Electronic Components and Technology Conference.
[8] G. Harman. Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield , 1997 .
[9] Joseph R. Davis. Properties and selection : nonferrous alloys and special-purpose materials , 1990 .
[10] William J. Greig,et al. Integrated Circuit Packaging, Assembly and Interconnections , 2007 .
[11] Sam Zhang,et al. Recrystallization of gold alloys for producing fine bonding wires , 1997 .
[12] Kyu Hwan Oh,et al. Recrystallization and grain growth of cold-drawn gold bonding wire , 2003 .
[13] J. H. Westbrook,et al. The Science of hardness testing and its research applications : based on papers presented at a symposium of the American Society for Metals, October 18 to 20, 1971 , 1973 .
[14] Masahiro Koizumi,et al. Influence of ball‐forming conditions on the hardness of copper balls , 1990 .