A fusion prognostics-based qualification test methodology for microelectronic products

Abstract The global market for microelectronic products is projected to reach US$2.4 trillion per year by 2020. This growth has led to intense competition between manufacturers to minimize the time-to-market for their products. Unfortunately, however, qualification testing, which is time-consuming and resource-intensive, is a major bottleneck for the quick release of microelectronic products to the market. Hence, for both researchers and engineers considering the time with reliability issues during qualification testing, this paper provides a review of conventional methodologies in qualification testing and presents a fusion prognostics-based qualification test methodology that combines the advantages of physics-of-failure and data-driven methods.

[1]  M. Pecht,et al.  Precursor Parameter Identification for Insulated Gate Bipolar Transistor (IGBT) Prognostics , 2009, IEEE Transactions on Reliability.

[2]  Michael G. Pecht,et al.  Electronic device encapsulation using red phosphorus flame retardants , 2006, Microelectron. Reliab..

[3]  M.G. Pecht,et al.  Establishing a Relationship Between Warranty and Reliability , 2006, IEEE Transactions on Electronics Packaging Manufacturing.

[4]  Michael Pecht,et al.  Prognostics-based product qualification , 2009, 2009 IEEE Aerospace conference.

[5]  A. Dasgupta,et al.  Failure mechanism models for brittle fracture , 1992 .

[6]  M. Pecht,et al.  Physics-of-failure: an approach to reliable product development , 1995, IEEE 1995 International Integrated Reliability Workshop. Final Report.

[7]  M. Pecht,et al.  Identification of failure precursor parameters for Insulated Gate Bipolar Transistors (IGBTs) , 2008, 2008 International Conference on Prognostics and Health Management.

[8]  Michael G. Pecht,et al.  A prognostic approach for non-punch through and field stop IGBTs , 2012, Microelectron. Reliab..

[9]  Michael G. Pecht,et al.  Parameter selection for health monitoring of electronic products , 2010, Microelectron. Reliab..

[10]  A. Dasgupta,et al.  Failure-mechanism models for creep and creep rupture , 1993 .

[11]  Donald Barker,et al.  Role of failure-mechanism identification in accelerated testing , 1992, Annual Reliability and Maintainability Symposium 1992 Proceedings.

[12]  Chiman Kwan,et al.  An Enhanced Prognostic Model for Intermittent Failures in Digital Electronics , 2007, 2007 IEEE Aerospace Conference.

[13]  Michael Pecht,et al.  Detecting failure precursors in BGA solder joints , 2009, 2009 Annual Reliability and Maintainability Symposium.

[14]  Michael Pecht,et al.  Intermittent Failures in Hardware and Software , 2014 .

[15]  Michael G. Pecht,et al.  The "trouble not identified" phenomenon in automotive electronics , 2002, Microelectron. Reliab..

[16]  Michael Pecht,et al.  Quality Conformance and Qualification of Microelectronic Packages and Interconnects , 1997 .

[17]  Michael G. Pecht,et al.  A prognostics and health management roadmap for information and electronics-rich systems , 2010, Microelectron. Reliab..

[18]  Michael G. Pecht,et al.  No-fault-found and intermittent failures in electronic products , 2008, Microelectron. Reliab..

[19]  M.G. Pecht,et al.  Prognostics and health management of electronics , 2008, IEEE Transactions on Components and Packaging Technologies.

[20]  Michael Osterman,et al.  Virtual Qualification of Electronic Hardware , 2003 .

[21]  A. Dasgupta,et al.  Failure mechanism models for plastic deformation , 1992 .

[22]  A. Preussger,et al.  Reliability qualification of semiconductor devices based on physics‐of‐failure and risk and opportunity assessment , 2002 .

[23]  A. Dasgupta,et al.  Failure mechanism models for cyclic fatigue , 1993 .