An application of the thermal network method to the thermal analysis of multichip packages (proposal of a simple thermal analysis model)

In recent years, electronic circuits have been required to be smaller and lighter and to have greater complexity, more multifunctions and higher reliability. High-density multichip packaging technology has been used in order to meet these requirements. The higher the density scale, the larger the power dissipation per unit area will become. Therefore, thermal analysis becomes one of the most important design factors. However, the multichip package heat transport mode is very complex and its treatment is tedious and time consuming. This paper describes an application of the thermal network method and proposes a simple thermal analysis model for the thermal analysis of multichip packages as a preliminary thermal design tool. As a result, the validity of the thermal network method and the simple thermal analysis model can be confirmed.