Electronic Packaging and Interconnection Handbook

Table of contents CONTRIBUTORS PREFACE Chapter 1: Plastics, Elastomers, and Composites Chapter 2: Adhesives, Underfills, and Coatings Chapter 3: Thermal Management Chapter 4: Connector and Interconnection Technology Chapter 5: Solder Technologies for Electronic Packaging and Assembly Chapter 6: Packaging and Interconnection of Integrated Circuits Chapter 7: Hybrid Microelectronics and Multichip Modules Chapter 8: Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies Chapter 9: Rigid and Flexible Printed Circuit Board Technology Chapter 10: Packaging of High-Speed and Microwave Electronic Systems INDEX