Selective removal of CuIn1−xGaxSe2 absorber layer with no edge melting using a nanosecond Nd : YAG laser

This paper reports that selective removal of a CuIn1−xGaxSe2 (CIGS) thin film on a Mo-coated glass substrate can be achieved with no edge melting or damage of the Mo layer using a nanosecond Nd:YAG laser with a wavelength of 1064nm. It is shown that the two crucial parameters that determine the possibility of clean removal of only the CIGS layer are Ga concentration of the CIGS film and laser fluence. For CIGS films with Ga/(Ga+In) ratio greater than about 0.2 for which the band gap energy is close to or over the photon energy (1.17eV), laser-induced thermal expansion proved to be the mechanism of film removal that drives an initial bulging of the film and then fracture into tens of micrometre sized fragments as observed in in situ shadowgraph images. The fracture-type removal of CIGS films was further verified by scanning electron micrographs of the craters showing that the original shapes of the CIGS polycrystals remain intact along the crater rim. A numerical simulation of film temperature under the irradiation conditions of selective removal was carried out to show that the magnitude of induced thermal stress within the film closely agreed to the yield strength of the CIGS thin film. The results confirmed that a nanosecond laser could be a better choice for P2 and P3 scribing of CIGS thin films if process conditions are properly determined. (Some figures may appear in colour only in the online journal)

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