论文信息 - Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements - 字舞流文

Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements

C. Wenzel | A. Jahn | F. Munnik | J. Bartha | M. Albert | K. Richter | U. Merkel | H. Wojcik | Marcel Junige | J. Gluch | C. Klein