High power electronic devices cooling at minimum ventilation power

In the present work, the cooling of a high power electronic device is studied. The device is in contact with a heat dissipator crossed by air. The air motion through the dissipator is forced by a fan whose supplied power is to be minimized. A finite element dynamic model of the dissipator is firstly created, taking geometrical and physical properties into account as well as steady state experimental data. A simplified model is then obtained, which reproduces the time pattern of the maximum dissipator temperature as a response of the thermal flux removed from the electronic device and the mass flow rate of the air. Afterwards, the simplified model is utilized to build a control system which allows the electronic device to be correctly cooled at minimum air ventilation power during transition to steady states. Genetic algorithms are used to find the parameters of the finite element model and of the control system. Some functioning conditions of the electronic device are lastly considered and discussed.

[1]  Giampietro Fabbri,et al.  Heat transfer optimization in corrugated wall channels , 2000 .

[2]  Ravi Kandasamy,et al.  Application of computational fluid dynamics simulation tools for thermal characterization of electronic packages , 2005 .

[3]  John Daniel. Bagley,et al.  The behavior of adaptive systems which employ genetic and correlation algorithms : technical report , 1967 .

[4]  Nestor V. Queipo,et al.  Genetic algorithms for thermosciences research: application to the optimized cooling of electronic components , 1994 .

[5]  Ishak Abdul Azid,et al.  Optimization of fins used in electronic packaging , 2005 .

[6]  R. Shah,et al.  Thermal Boundary Conditions and Some Solutions for Laminar Duct Flow Forced Convection , 1974 .

[7]  Avram Bar-Cohen.  Thermal Management of Air- and Liquid-Cooled Multichip Modules , 1987 .

[8]  Jerald D. Parker,et al.  Introduction to fluid mechanics and heat transfer , 1969 .

[9]  Giampietro Fabbri,et al.  Heat transfer optimization in internally finned tubes under laminar flow conditions , 1998 .

[10]  Kankanhalli N. Seetharamu,et al.  Thermal management of multi‐chip module and printed circuit board using FEM and genetic algorithms , 2005 .

[11]  Avram Bar-Cohen,et al.  Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1 , 1988 .

[12]  Giampietro Fabbri.  Optimum profiles for asymmetrical longitudinal fins in cylindrical ducts , 1999 .

[13]  M. F. Yeo,et al.  Optimising engineering problems using genetic algorithms , 1998 .

[14]  R. Shah,et al.  Handbook of single-phase convective heat transfer , 1987 .