Large grain polycrystalline silicon by low‐temperature annealing of low‐pressure chemical vapor deposited amorphous silicon films

The crystallization of undoped amorphous silicon films deposited by low‐pressure chemical vapor deposition in the temperature range 580–530 °C and annealed from 550 to 950 °C has been studied by transmission electron microscopy. The average grain size of the crystallized films depends on the annealing temperature and the deposition conditions. The nucleation rate of new grains during annealing decreases as the deposition temperature decreases from 580 to 545 °C and/or when the deposition rate increases. The final grain size is also influenced by the annealing temperature with the largest grain size obtained at low annealing temperatures. A simple model is described which explains the dependence of grain size on the annealing temperature. An average grain size of 500 nm has been obtained in a 200‐nm film deposited at 545 °C and annealed at 550 °C.

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