Low cost scaleable parallel image processing system

Abstract The design and application of a DSP-based Parallel Image Processing system is presented. A scaleable system based around a TMS320C40 DSP Master–Slave architecture is shown to be a suitable vehicle for industrial inspection problems. Custom vision bus and parallel communication channels are used to pass data between local and shared memory in the image processing system. The target application of SMT solder bond inspection required the fast processing of 2-D FFTs. Analysis of the system's suitability to this task is presented followed by actual results from a three-processor system. The target inspection rate of 100 SMT solder joints per second can be met.

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