Printability of 2D mask quality
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[1] John L. Sturtevant,et al. Contact-hole MEEF comparison between ALTA and 50-KeV written masks , 2003, SPIE Advanced Lithography.
[2] John L. Sturtevant,et al. Characterization of optical proximity correction features , 2001, SPIE Advanced Lithography.
[3] Vicky Philipsen,et al. Printability study for phase-shift masks at 193-nm lithography , 2003, European Mask and Lithography Conference.
[4] Vincent Wiaux,et al. Reticle quality needs for advanced 193-nm lithography , 2001, Photomask Japan.
[5] Rik Jonckheere. 2002 update on the SEMI Standards Mask Qualification Terminology Task Force , 2002, Photomask Technology.
[6] Vincent Wiaux,et al. ArF solutions for low-k1 back-end imaging , 2003, SPIE Advanced Lithography.
[7] Chris A. Mack,et al. Lithography performance of contact holes: II. Simulation of the effects of reticle corner rounding on wafer print performance , 2000, Photomask Japan.
[8] Rik Jonckheere. 2001 update on the SEMI Standards Mask Qualification Terminology Task Force , 2002, SPIE Photomask Technology.
[9] Franklin M. Schellenberg,et al. Impact of mask errors on full chip error budgets , 1999, Advanced Lithography.
[10] Vincent Wiaux,et al. Assessment of OPC effectiveness using two-dimensional metrics , 2002, SPIE Advanced Lithography.
[11] Vicky Philipsen,et al. Feature proximity errors on mask: assessment results of commercially obtained reticles , 2003, European Mask and Lithography Conference.
[12] Maurice Janssen,et al. Contact hole litho correlation with shape analysis , 2003, European Mask and Lithography Conference.