Electronic component and method for manufacturing an electronic component

The invention relates to an electronic component (E), comprising at least one multi-layer circuit substrate (1) which is equipped with a number of mechanical and / or electronic components (2, 3). According to the invention, the circuit carrier (1) consists of a number of circuit carrier layers (1.1) is formed, embedded at least one of the mechanical components (2) in the circuit carrier (1) and is accessible from the outside or can be exposed from the outside. Furthermore, the invention relates to a method of manufacturing an electronic component (E).