Small Size, Low Thermal Resistance and High Reliability Packaging Technologies of IGBT Module for Wind Power Applications

In order to feature in next generation wind power generation systems, a new 600A-1700V IGBT module has been developed. The module has (1) low thermal resistance realized by thermal-greaseless “direct-liquid-cooling” technology with pin-fin, whose pressure drop and fin efficiency are optimally designed, (2) small package size, which enables compact power conditioner system, (3) high reliability and long lifetime realized by high strength Si3N4 insulated substrate and newly developed RoHS bonding technologies. The thermal resistance Rj-w of the IGBT module is reduced by 35 percent when compared to “indirect-cooling” conventional modules using thermal grease. The developed IGBT module and channel cover jacket are approximately 37 percent lighter and 45 percent smaller when compared to conventional modules with the same power capability.