Key technologies and interfacial fundamentals of wafer plating equipment

[1]  D. Gall.  The search for the most conductive metal for narrow interconnect lines , 2020, Journal of Applied Physics.

[2]  Z. Jia,et al.  Analysis of Pollution in High Voltage Insulators via Laser-Induced Breakdown Spectroscopy , 2020, Molecules.

[3]  Q. Le,et al.  Controlled cobalt recess for advanced interconnect metallization , 2019, Microelectronic Engineering.

[4]  L. Magagnin,et al.  Review—Ruthenium as Diffusion Barrier Layer in Electronic Interconnects: Current Literature with a Focus on Electrochemical Deposition Methods , 2018, Journal of The Electrochemical Society.

[5]  S. Branagan,et al.  Mechanism of Cobalt Bottom-Up Filling for Advanced Node Interconnect Metallization , 2018, Journal of The Electrochemical Society.

[6]  T. Moffat,et al.  SEIRAS Study of Chloride-Mediated Polyether Adsorption on Cu. , 2018, The journal of physical chemistry. C, Nanomaterials and interfaces.

[7]  V. Isaev,et al.  On the theory of 3D multiple nucleation with kinetic controlled growth , 2018, Journal of Electroanalytical Chemistry.

[8]  Shao-Hua Wu,et al.  Molar Range Detection Based on Sideband Differential Absorption Spectroscopy with a Concentrated Reference. , 2017, Analytical chemistry.

[9]  Liming Gao,et al.  Wetting process of copper filling in through silicon vias , 2015 .

[10]  J. Onuki,et al.  Structural features of nano-scale damascene copper lines after annealing in wide temperature range , 2014 .

[11]  B. Ren,et al.  Electrochemical and in Situ SERS Studies on the Adsorption of 2-Hydroxypyridine and Polyethyleneimine during Silver Electroplating , 2008 .

[12]  Guonan Chen,et al.  In Situ Monitoring of Additives in Copper Plating Baths by Cyclic Voltammetric Stripping with a Microelectrode , 2007 .

[13]  S. Oh,et al.  High-Aspect-Ratio Copper Via Filling Used for Three-Dimensional Chip Stacking , 2003 .

[14]  Panayotis C. Andricacos,et al.  Damascene copper electroplating for chip interconnections , 1998, IBM J. Res. Dev..

[15]  B. Scharifker,et al.  Theoretical and experimental studies of multiple nucleation , 1983 .

[16]  C. Ogden,et al.  A New Voltammetric Stripping Method Applied to the Determination of the Brightener Concentration in Copper Pyrophosphate Plating Baths , 1978 .

[17]  J. Lau.  Semiconductor Advanced Packaging , 2021 .

[18]  Tetsuya Osaka,et al.  Advanced nanoscale ULSI interconnects : fundamentals and applications , 2009 .

[19]  A. Bewick,et al.  Kinetics of the electrocrystallization of thin films of calomel , 1962 .