论文信息 - Fast full wave analysis of PCB via arrays with model-to-hardware correlation

Fast full wave analysis of PCB via arrays with model-to-hardware correlation

This paper applies a methodology based on a mostly-analytical Foldy-Lax full wave scattering model to analyze via arrays in a multilayered printed circuit board. We have demonstrated good model-to-hardware correlation up to 20 GHz by simulating and measuring 8×8 via arrays including 29 signal vias and 35 ground vias in a 18-layer test board. The required CPU in the 64-via case is 4 seconds which is more than four orders of magnitude faster than the market leading general-purpose 3D full wave solver.

[1] Qin Li,et al. Analysis of a large number of vias and differential signaling in multilayered structures , 2003 .

[2] Xiaoxiong Gu,et al. Application of Foldy-Lax Multiple Scattering Method To Via Analysis in Multi-layered Printed Circuit Board , 2008 .

[3] Xiaoxiong Gu,et al. Is 25 Gb/s On-Board Signaling Viable? , 2009, IEEE Transactions on Advanced Packaging.

[4] Leung Tsang,et al. Signal Integrity Analysis of Package and Printed Circuit Board With Multiple Vias in Substrate of Layered Dielectrics , 2010, IEEE Transactions on Advanced Packaging.

[5] Leung Tsang,et al. Modeling Multiple Vias With Arbitrary Shape of Antipads and Pads in High Speed Interconnect Circuits , 2009, IEEE Microwave and Wireless Components Letters.