Anomalous Fe diffusion in Si-ion-implanted β–Ga2O3 and its suppression in Ga2O3 transistor structures through highly resistive buffer layers

The thermal behavior of Fe as a compensating acceptor impurity in β-Ga2O3 (010) was studied in view of growing interests in semi-insulating Fe-doped Ga2O3 substrates for the realization of high-performance Ga2O3 field-effect transistors (FETs). An anomalous redistribution of Fe beyond the extent of intrinsic thermal diffusion was revealed by secondary ion mass spectroscopy in device-relevant structures where Ga2O3 grown homoepitaxially on Fe-doped substrates was doped by Si ion (Si+) implantation and annealed at high temperatures. The enhanced Fe diffusion was attributed to an athermal process involving intrinsic defects from the region of implantation damage. An undoped Ga2O3 buffer between the Si+-implanted layer and the Fe-doped substrate effectively suppressed Fe outdiffusion by protecting the substrate against unintentional ion damage or defects from a remote source, thereby preserving the electrical integrity of the Si-doped material. Temperature-dependent current-voltage measurements indicated that the undoped Ga2O3 buffer was highly resistive with inter-device leakage attributable to surface conduction via a variable-range hopping mechanism. The buffer scheme, together with dielectric passivation to eliminate surface leakage, was proposed to constitute an integral process module for future lateral Ga2O3 FET devices.

[1]  Akito Kuramata,et al.  Gallium oxide (Ga2O3) metal-semiconductor field-effect transistors on single-crystal β-Ga2O3 (010) substrates , 2012 .

[2]  Kazuo Nakajima,et al.  Fabrication and characterization of transparent conductive Sn-doped β-Ga2O3 single crystal , 2007 .

[3]  Steffen Ganschow,et al.  Czochralski growth and characterization of β‐Ga2O3 single crystals , 2010 .

[4]  B. Streetman,et al.  SIMS Studies of Semi‐Insulating InP Amorphized by Mg and Si , 1982 .

[5]  T. E. Haynes,et al.  Physical mechanisms of transient enhanced dopant diffusion in ion-implanted silicon , 1997 .

[6]  Akito Kuramata,et al.  Si-Ion Implantation Doping in β-Ga2O3 and Its Application to Fabrication of Low-Resistance Ohmic Contacts , 2013 .

[7]  Akito Kuramata,et al.  Growth temperature dependences of structural and electrical properties of Ga2O3 epitaxial films grown on β-Ga2O3 (010) substrates by molecular beam epitaxy , 2014 .

[8]  Hideo Hosono,et al.  Deep-ultraviolet transparent conductive β-Ga2O3 thin films , 2000 .

[9]  B. Streetman,et al.  Iron and Chromium Redistribution in Semi‐Insulating InP , 1981 .

[10]  Extended defect evolution in boron‐implanted Si during rapid thermal annealing and its effects on the anomalous boron diffusion , 1990 .

[11]  Akito Kuramata,et al.  Device-Quality β-Ga2O3 Epitaxial Films Fabricated by Ozone Molecular Beam Epitaxy , 2012 .

[12]  R. Wilson,et al.  Redistribution of Fe in InP during liquid phase epitaxy , 1981 .

[13]  Tohru Honda,et al.  Correlation between blue luminescence intensity and resistivity in β-Ga2O3 single crystals , 2013 .

[14]  Seiya Kasai,et al.  Mechanism of surface conduction in the vicinity of Schottky gates on AlGaN∕GaN heterostructures , 2007 .

[15]  Reinhard Uecker,et al.  On the bulk β-Ga2O3 single crystals grown by the Czochralski method , 2014 .

[16]  A. Katsui,et al.  Redistribution of Fe in thermally annealed semi‐insulating InP(Fe): Determination of Fe diffusion coefficient in InP , 1984 .

[17]  N. Cowern,et al.  Transient enhanced diffusion of phosphorus in silicon , 1986 .

[18]  H. H. Tippins Optical Absorption and Photoconductivity in the Band Edge of β − Ga 2 O 3 , 1965 .

[19]  K. Imanishi,et al.  New Model of Fe Diffusion in Highly Resistive Fe-Doped Buffer Layer for GaN High-Electron-Mobility Transistor , 2013 .

[20]  Peter Reiche,et al.  Czochralski grown Ga2O3 crystals , 2000 .

[21]  Akito Kuramata,et al.  Depletion-mode Ga2O3 metal-oxide-semiconductor field-effect transistors on β-Ga2O3 (010) substrates and temperature dependence of their device characteristics , 2013 .

[22]  C. Drum,et al.  Ion‐implantation‐damage gettering effect in silicon photodiode array camera target , 1973 .

[23]  A. E. Michel,et al.  Implantation damage and the anomalous transient diffusion of ion‐implanted boron , 1987 .

[24]  Umesh K. Mishra,et al.  Growth of Fe doped semi-insulating GaN by metalorganic chemical vapor deposition , 2002 .

[25]  M. Gauneau,et al.  Further evidence of chromium, manganese, iron, and zinc redistribution in indium phosphide after annealing , 1985 .

[26]  V. G. Riggs,et al.  Growth of Fe-doped semi-insulating InP by MOCVD , 1984 .

[27]  S. Yamakoshi,et al.  Depletion-mode Ga2O3 MOSFETs on β-Ga2O3 (010) substrates with Si-ion-implanted channel and contacts , 2013, 2013 IEEE International Electron Devices Meeting.

[28]  C. Bozler,et al.  Impurity gettering in semi‐insulating gallium arsenide using ion‐implantation damage , 1976 .

[29]  Noboru Ichinose,et al.  Large-size β-Ga2O3 single crystals and wafers , 2004 .

[30]  Hideo Hosono,et al.  Synthesis and control of conductivity of ultraviolet transmitting β-Ga2O3 single crystals , 1997 .

[31]  Jun Liu,et al.  Transient enhanced diffusion during rapid thermal annealing of boron implanted silicon , 1985 .

[32]  J. Merz,et al.  Iron redistribution and compensation mechanisms in semi‐insulating Si‐implanted InP , 1989 .

[33]  S. Decoutere,et al.  Transient enhanced diffusion of Boron in Si , 2002 .