Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs

In this paper, we propose a vertical stepped impedance electromagnetic bandgap (VSI-EBG) structure with a stopband enhancement and a size reduction for a wideband suppression of simultaneous switching noise (SSN) coupling in multilayer printed circuit boards (PCBs). The proposed VSI-EBG structure forms the stepped impedance EBG structure of power planes, which is implemented with a vertical branch, high-impedance (hi-Z) and low-impedance (low-Z) metal patches on different layers. Test vehicles are fabricated using a multilayer PCB process to verify the proposed VSI-EBG structure. Through experimental measurements, we verified the enhanced suppression of SSN coupling (below -40 dB) between 650 MHz and 20 GHz. In addition, we demonstrated that fL is reduced from 2.4 GHz to 650 MHz compared to the previous EBG structure, which allows an approximately 86% size reduction.

[1]  Joungho Kim,et al.  Hybrid analytical modeling method for split power bus in multilayered package , 2006, IEEE Transactions on Electromagnetic Compatibility.

[2]  Tzong-Lin Wu,et al.  Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB , 2004 .

[3]  Tzong-Lin Wu,et al.  Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation , 2010, IEEE Transactions on Electromagnetic Compatibility.

[4]  Kaushik Roy,et al.  An Analytical Fringe Capacitance Model for Interconnects Using Conformal Mapping , 2006, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[5]  Jinwoo Choi,et al.  Noise Isolation in Mixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure-Based Power Distribution Network (PDN) , 2010, IEEE Transactions on Advanced Packaging.

[6]  D. Sievenpiper,et al.  High-impedance electromagnetic surfaces with a forbidden frequency band , 1999 .

[7]  Wei-Da Guo,et al.  A Systematic Design to Suppress Wideband Ground Bounce Noise in High-Speed Circuits by Electromagnetic-Bandgap-Enhanced Split Powers , 2006, IEEE Transactions on Microwave Theory and Techniques.

[8]  Joungho Kim,et al.  High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions , 2005 .

[9]  Tzong-Lin Wu,et al.  A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures , 2004, IEEE Microwave and Wireless Components Letters.

[10]  Jinwoo Choi,et al.  Isolation in mixed-signal systems using a novel electromagnetic bandgap (EBG) structure , 2004, Electrical Performance of Electronic Packaging - 2004.

[11]  Ki Hyuk Kim,et al.  Design of EBG Power Distribution Networks With VHF-Band Cutoff Frequency and Small Unit Cell Size for Mixed-Signal Systems , 2007, IEEE Microwave and Wireless Components Letters.

[12]  Y. Toyota,et al.  Modeling of gapped power bus structures for isolation using cavity modes and segmentation , 2003, IEEE Transactions on Electromagnetic Compatibility.

[13]  Tzong-Lin Wu,et al.  Design and Modeling of a Stopband-Enhanced EBG Structure Using Ground Surface Perturbation Lattice for Power/Ground Noise Suppression , 2009, IEEE Transactions on Microwave Theory and Techniques.

[14]  Tzong-Lin Wu,et al.  Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits , 2005 .

[15]  Jie Qin,et al.  Ultra-Wideband Mitigation of Simultaneous Switching Noise Using Novel Planar Electromagnetic Bandgap Structures , 2006, IEEE Microwave and Wireless Components Letters.

[16]  R. Abhari,et al.  Suppression of the parallel-plate noise in high-speed circuits using a metallic electromagnetic band-gap structure , 2002, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).