论文信息 - Forced Convection in Microstructures for Electronic Equipment Cooling - 字舞流文

Forced Convection in Microstructures for Electronic Equipment Cooling

This work was sUIψorted by EPRC (Electronic Packaging Research Center) at KAIST, and KOSEF (Korea Science and Engineering Foundation).

Sung Jin Kim | Duckjong Kim | Duckjong Kim | S. Kim

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