Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package

This study presents a detailed experimental investigation of the combined effects of pressure and subcooling on nucleate pool boiling and critical heat flux (CHF) for degassed fluorocarbon FC-72 boiling on a plastic pin-grid-array (PPGA) chip package. In these experiments pressure was varied between 101.3 and 303.9 kPa and the subcooling ranged from 0 to 65°C. As expected, lower wall superheats resulted from increases in pressure, while subcooling had a minimal effect on fully developed pool boiling. However, the superheat reductions and CHF enhancements were found to be smaller than those predicted by existing models. The CHF for saturated liquid conditions increased by nearly 17 percent for an increase in pressure from 101.3 to 202.7 kPa. In experiments with both FC-72 and FC-87 further increases in pressure did not produce any significant increase in CHF. At a pressure of 101.3 kPa a subcooling of 30°C increased CHF on horizontal upward-facing chips by approximately 50 percent, as compared to 70 percent on vertically oriented packages. The enhancement in CHF due to subcooling decreased rapidly with increasing pressure, and the data showed that the influence of pressure and subcooling on CHF is not additive. A correlation to predict pool boiling CHF under the combined effects of pressure and subcooling is proposed.

[1]  A. Bergles,et al.  Effects of Size of Simulated Microelectronic Chips on Boiling and Critical Heat Flux , 1988 .

[2]  Boiling incipience and nucleate boiling heat transfer of highly-wetting dielectric fluids from electronic materials , 1990 .

[3]  J. Lienhard,et al.  Hydrodynamic Prediction of Peak Pool-boiling Heat Fluxes from Finite Bodies , 1973 .

[4]  Fujio Tachibana,et al.  NON-HYDRODYNAMIC ASPECTS OF POOL BOILING BURNOUT. , 1967 .

[5]  H. Shulman,et al.  Critical heat flux values at sub-atmospheric pressures , 1966 .

[6]  C. Schenone,et al.  Pool boiling heat transfer of dielectric fluids for immersion electronic cooling: effects of pressure , 1994 .

[7]  V. Dhir,et al.  Nucleate and transition boiling heat transfer under pool and external flow conditions , 1991 .

[8]  U. P. Hwang,et al.  Boiling heat transfer of silicon integrated circuits chip mounted on a substrate , 1981 .

[9]  Vijay K. Dhir.  Nucleate and transition boiling heat transfer under pool and external flow conditions , 1991 .

[10]  Hideaki Imura,et al.  Natural-convection heat transfer from a plate with arbitrary inclination , 1972 .

[11]  E. Nannei,et al.  On the effect of heating wall thickness on pool boiling burnout , 1976 .

[12]  J. Lienhard,et al.  The Effect of Pressure, Geometry, and the Equation of State Upon the Peak and Minimum Boiling Heat Flux , 1963 .

[13]  W. Rohsenow.  A Method of Correlating Heat-Transfer Data for Surface Boiling of Liquids , 1952, Journal of Fluids Engineering.

[14]  J. Lienhard,et al.  On Correlating the Peak and Minimum Boiling Heat Fluxes With Pressure and Heater Configuration , 1966 .

[15]  V. Morozov.  An experimental study of critical heat loads at boiling of organic liquids on a submerged heating surface , 1961 .

[16]  L. Bernath.  A THEORY OF LOCAL-BOILING BURNOUT AND ITS APPLICATION TO EXISTING DATA , 1960 .

[17]  J. Addoms.  Heat transfer at high rates to water boiling outside cylinders , 1948 .

[18]  Avram Bar-Cohen,et al.  Thermal management of electronic components with dielectric liquids , 1993 .

[19]  S. J. Kline,et al.  Describing Uncertainties in Single-Sample Experiments , 1953 .

[20]  J. Lienhard,et al.  Influences of subcooling on burnout of horizontal cylindrical heaters , 1988 .

[21]  Terrence W. Simon,et al.  Experimental investigation of nucleate boiling incipience with a highly-wetting dielectric fluid (R-113) , 1990 .