A parallel optical interconnect link with on-chip optical access

This paper describes a complete technology family for parallel optical interconnect systems. Key features are the two-dimensional on-chip optical access and the development of a complete optical pathway. This covers both chip-to-chip links on a single boards, chip-to-chip links over an optical backpanel, and even system-to-system interconnects. Therefore it is a scalable technology. The design of all parts of the link, and the integration of parallel optical interconnect systems in the design flow of electronic systems is presented in this paper.

[1]  David V. Plant,et al.  Design and test of an optoelectronic-VLSI chip with 540-element receiver-transmitter arrays using differential optical signaling , 2003 .

[2]  T. Satake,et al.  MT multifiber connectors and new applications , 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

[3]  W. Bachtold,et al.  Highly uniform vertical-cavity surface-emitting lasers integrated with microlens arrays , 2000, IEEE Photonics Technology Letters.

[4]  T. Heide,et al.  Monolithic high-speed CMOS-photoreceiver , 1999, IEEE Photonics Technology Letters.

[5]  Jean-Luc Tissot,et al.  Collective flip-chip technology for infrared focal plane arrays , 2000 .

[6]  Roel G. Baets,et al.  Circuit-level simulation approach to analyze system-level behavior of VCSEL-based optical interconnects , 2003, Photonics Fabrication Europe.

[7]  P. Heremans,et al.  Inter-chip optical interconnects using imaging fiber bundles and integrated CMOS detectors , 2001, Proceedings 27th European Conference on Optical Communication (Cat. No.01TH8551).

[8]  Jan Van Campenhout,et al.  Design Methodology Development for VCSEL-based Guided-Wave Optical Interconnects , 2003 .

[9]  Y. Koike,et al.  Progress of low-loss GI polymer optical fiber from visible to 1.5-μm wavelength , 1997 .

[10]  Detlef Kuhl,et al.  Current progress of advanced high speed parallel optical links for computer clusters and switching systems , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[11]  E. Griese A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems , 2001 .

[12]  R. Viswanath Thermal Performance Challenges from Silicon to Systems , 2000 .

[13]  David A. B. Miller,et al.  Limit to the Bit-Rate Capacity of Electrical Interconnects from the Aspect Ratio of the System Architecture , 1997, J. Parallel Distributed Comput..

[14]  M. Blaser,et al.  High performance monolithically integrated InP photoreceivers , 1994, Proceedings of 1994 IEEE 6th International Conference on Indium Phosphide and Related Materials (IPRM).

[15]  D.A.B. Miller,et al.  Rationale and challenges for optical interconnects to electronic chips , 2000, Proceedings of the IEEE.

[16]  J. Dambre,et al.  Demonstrating POF based optoelectronic interconnect in a multi-FPGA prototype system , 2001, Proceedings 27th European Conference on Optical Communication (Cat. No.01TH8551).

[17]  Martin L. Schmatz,et al.  Optical links for printed circuit boards , 2003, The 16th Annual Meeting of the IEEE Lasers and Electro-Optics Society, 2003. LEOS 2003..

[18]  N. Savage,et al.  Linking with Light , 2002 .

[19]  L. Chirovsky,et al.  16 x 16 VCSEL array flip-chip bonded to CMOS VLSI circuit , 2000, IEEE Photonics Technology Letters.

[20]  J. Cunningham,et al.  A 36-channel parallel optical interconnect module based on optoelectronics-on-VLSI technology , 2003 .