비접촉식 웨이퍼척의 유압 변형에 미치는 구조 및 유동해석

The high-integration trend in semiconductor production process inevitably has brought the increase of contact or contaminants generated by shock are prevented during wafer handling processing substrate. This wafer chuck device with atmospheric pressure or chemical vapor deposition equipment for transporting and transferring wafers, robot hands carry these longer and wider wafers can also be easily chuck. As a contact chuck system composed of several problems in increased potential for fracture or warping. A non contact chuck system is required to solve this problem. The wafer warping makes it difficult to carry out conventional contact to analysis. We propose a new non contact transportation system with combining air suction and blowout. The numerical analysis and experimental is, therefore, should be performed to obtain compared to results achieved with non contact solutions. This wafer non contact chuck shows its strength in maintaining high cleanliness levels for semiconductor production processes.