Charge transport mechanism in metal-nitride-oxide-silicon structures

A charge transport mechanism in double oxide-nitride dielectric was studied experimentally and theoretically. We have found that widely accepted Frenkel effect or thermally assisted tunneling could not explain experimental current-field-temperature dependences. For the first time we demonstrate that ionization mechanism of deep traps, which control charge transport in silicon nitride, is due to multiphonon process.

[1]  S. Minami,et al.  A novel MONOS nonvolatile memory device ensuring 10-year data retention after 10/sup 7/ erase/write cycles , 1993 .

[2]  Effects of two-step high temperature deuterium anneals on SONOS nonvolatile memory devices , 2001, IEEE Electron Device Letters.

[3]  V. I. Belyĭ Silicon nitride in electronics , 1988 .

[4]  Hans Reisinger,et al.  Transient conduction in multidielectric silicon–oxide–nitride–oxide semiconductor structures , 2001 .

[5]  T. P. Ma,et al.  Making Silicon Nitride Film a Viable Gate Dielectric , 1998 .

[6]  K. Kano Semiconductor Devices , 1997 .

[7]  S. M. Sze,et al.  Physics of semiconductor devices , 1969 .

[8]  Robert M. Hill,et al.  Poole-Frenkel conduction in amorphous solids , 1971 .

[9]  J. Bu,et al.  Improvement in retention reliability of SONOS nonvolatile memory devices by two-step high temperature deuterium anneals , 2001, 2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167).

[10]  K. Lehovec,et al.  Transient charge and current distributions in the nitride of MNOS devices , 1977, IEEE Transactions on Electron Devices.

[11]  I. Yassievich,et al.  Nonradiative Recombination in Semiconductors , 1991 .

[12]  S. Manzini,et al.  Electronic processes in silicon nitride , 1987 .

[13]  Simon M. Sze,et al.  Current Transport and Maximum Dielectric Strength of Silicon Nitride Films , 1967 .

[14]  Tso-Ping Ma,et al.  Electrical properties of high-quality ultrathin nitride/oxide stack dielectrics , 1999 .

[15]  V. A. Gritsenko,et al.  Two‐band conduction of amorphous silicon nitride , 1974 .

[16]  K. Yoshikawa,et al.  Thickness scaling limitation factors of ONO interpoly dielectric for nonvolatile memory devices , 1996 .

[17]  Piero Migliorato,et al.  A new generation-recombination model for device simulation including the Poole-Frenkel effect and phonon-assisted tunnelling , 1997 .

[18]  Ichiro Fujiwara,et al.  Analysis of Carrier Traps in Si3N4 in Oxide/Nitride/Oxide for Metal/Oxide/Nitride/Oxide/Silicon Nonvolatile Memory , 1999 .

[19]  G. Lo,et al.  Highly reliable SiO/sub 2//Si/sub 3/N/sub 4/ stacked dielectric on rapid-thermal-nitrided rugged polysilicon for high-density DRAM's , 1992, IEEE Electron Device Letters.

[20]  R. Williams,et al.  The effect of electrical conduction of Si3N4on the discharge of MNOS memory transistors , 1978, IEEE Transactions on Electron Devices.

[21]  Tso-Ping Ma,et al.  Making silicon nitride film a viable gate dielectric , 1998 .

[22]  S. Makram-Ebeid,et al.  Quantum model for phonon-assisted tunnel ionization of deep levels in a semiconductor , 1982 .