Applications of Latent Open Test
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As metal interconnections in multichip modules (MCM) are getting narrower and thinner, latent open defects such as notches, nicks, weak connections, etc., will have a greater chance to occur under normal manufacturing processes. We have applied a phase-sensitive nonlinearity detection technique to detect such latent open defects in MCM-D and MCM-C substrates. Use of this technique for qualifying opens repair techniques and wire bonding process control is reported.
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