Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test

Purpose – The purpose of this paper is to evaluate the mechanical properties of nano‐silver paste sintered lap shear structures and to discuss the effects of loading rate and ambient temperature on shear strength and fracture mechanism.Design/methodology/approach – Single lap shear joints with an area of 2 mm2 and thickness of 50 μm were fabricated by joining two copper substrates with nano‐silver paste. The lap shear tests were carried out under strain control mode on a micro uniaxial fatigue testing system with four loading rates and temperatures. The fracture sections were analyzed by SEM observation to determine the effect of temperature on the fracture mechanism.Findings – Results from the study highlighted that the shear strain rate and temperature can have a significant impact on the shear behaviour of nano‐silver paste sintered lap shear joints. The shear strength increased with shear strain rate, but decreased with increasing ambient temperature. The lap shear joints displayed excellent ductility...

[1]  Sunit Rane,et al.  A study on sintering and microstructure development of fritless silver thick film conductors , 2000 .

[2]  Paul A. Kohl,et al.  Silver metallization for advanced interconnects , 1999 .

[3]  R.W. Johnson,et al.  The changing automotive environment: high-temperature electronics , 2004, IEEE Transactions on Electronics Packaging Manufacturing.

[4]  Guo-Quan Lu,et al.  Strategies for Improving Reliability of Solder Joints on Power Semiconductor Devices , 2003 .

[5]  Guo-Quan Lu,et al.  Strategies for improving the reliability of solder joints on power semiconductor devices , 2004 .

[6]  Guo-Quan Lu,et al.  Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly , 2006, IEEE Transactions on Device and Materials Reliability.

[7]  Xu Chen,et al.  Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment , 2009 .

[8]  Jau-Ho Jean,et al.  Effects of Silver‐Paste Formulation on Camber Development during the Cofiring of a Silver‐Based, Low‐Temperature‐Cofired Ceramic Package , 2005 .

[9]  F. A. Kish,et al.  High-brightness AlGaInP light emitting diodes , 1997, Proc. IEEE.

[10]  C. Su,et al.  An elastic–plastic interface constitutive model: application to adhesive joints , 2004 .

[11]  Jian Pu,et al.  Thermo-mechanical properties of ultra high strength steel 22SiMn2TiB at elevated temperature , 2011 .

[12]  S. Menzel,et al.  Microstructure of electroplated Cu(Ag) alloy thin films , 2011 .

[13]  Xu Chen,et al.  Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste , 2008 .

[14]  Takashi Mukai,et al.  High‐power InGaN/GaN double‐heterostructure violet light emitting diodes , 1993 .

[15]  Tao Wang,et al.  Uniaxial ratcheting and fatigue behaviors of low-temperature sintered nano-scale silver paste at room and high temperatures , 2010 .

[16]  Tao Wang,et al.  Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection , 2007 .

[17]  Guo-Quan Lu,et al.  Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow , 2002 .

[18]  J. W. Klein Silicon and gallium arsenide in high temperature electronics applications , 1995, Proceedings of ISSE'95 - International Symposium on Signals, Systems and Electronics.

[19]  K. Cheong,et al.  A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices , 2010 .

[20]  Guo-Quan Lu,et al.  Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material , 2006, IEEE Transactions on Components and Packaging Technologies.