Non-linear finite element analysis for electronic packages subjected to combined hygroscopic and thermo-mechanical stresses

A finite element modeling scheme to analyze the combined effect of thermal and hygroscopic deformation is presented. The scheme employs the conventional moisture diffusion and heat transfer analysis capabilities available in the commercial FEM packages, but a new formulation is introduced to allow the time-dependent non-linear analysis of package deformations induced by hygroscopic as well as thermal expansion mismatches. Validity of modeling scheme is verified using time-dependent displacement fields of a bi-material specimen documented by real-time moire interferometry

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