Reliability and Fatigue Analysis in Cantilever-Based MEMS Devices Operating in Harsh Environments

The microelectromechanical system (MEMS) is one of the most diversified fields of microelectronics; it is rated to be the most promising technology of modern engineering. MEMS can sense, actuate, and integrate mechanical and electromechanical components of micro- and nano sizes on a single silicon substrate using microfabrication techniques. MEMS industry is at the verge of transforming the semiconductor world into MEMS universe, apart from other hindrances; the reliability of these devices is the focal point of recent research. Commercialization is highly dependent on the reliability of these devices. MEMS requires a high level of reliability. Several technological factors, operating conditions, and environmental effects influencing the performances of MEMS devices must be completely understood. This study reviews some of the major reliability issues and failure mechanisms. Specifically, the fatigue in MEMS is a major material reliability issue resulting in structural damage, crack growth, and lifetime measurements of MEMS devices in the light of statistical distribution and fatigue implementation of Paris' law for fatigue crack accumulation under the influence of undesirable operating and environmental conditions.

[1]  K.E. Petersen,et al.  Silicon as a mechanical material , 1982, Proceedings of the IEEE.

[2]  D. Cho,et al.  The surface/bulk micromachining (SBM) process: a new method for fabricating released MEMS in single crystal silicon , 1999 .

[3]  Yoshitada Isono,et al.  Fatigue Life Prediction Criterion for Micro-Nanoscale Single-Crystal , 2009 .

[4]  J. Sharma,et al.  高アスペクト比MEMSデバイス製造のためのSF 6 ,BCl 3 およびArベースの処方を用いるモリブデンエッチング , 2013 .

[5]  Kaustubh Bhalerao,et al.  Modeling of fatigue in polysilicon MEMS structures , 2003 .

[6]  Fei Su,et al.  Defect-oriented testing and diagnosis of digital microfluidics-based biochips , 2005, IEEE International Conference on Test, 2005..

[7]  Keith A. Thomas,et al.  Evaluation of MEMS Capacitive Accelerometers , 1999, IEEE Des. Test Comput..

[8]  Bharat Bhushan,et al.  Scale dependence of micro/nano-friction and adhesion of MEMS/NEMS materials, coatings and lubricants , 2004 .

[9]  R. Mihailovich,et al.  Techniques for reliability analysis of MEMS RF switch , 2002, 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320).

[10]  Robert O. Ritchie,et al.  High-cycle Fatigue and Durability of Polycrystalline Silicon Thin ®lms in Ambient Air , 2022 .

[11]  Jeremy A. Walraven,et al.  Failure Analysis Issues in Microelectromechanical Systems (MEMS) , 2005, Microelectron. Reliab..

[12]  C. Myers,et al.  Strap-down microelectromechanical (MEMS) sensors for high-g munition applications , 2001 .

[13]  Wen-Ben Jone,et al.  Material Fatigue and Reliability of MEMS Accelerometers , 2008, 2008 IEEE International Symposium on Defect and Fault Tolerance of VLSI Systems.

[14]  L. D. Edmonds,et al.  Radiation effects in micro-electromechanical systems (MEMS): RF relays , 2002 .

[15]  Junyong Tao,et al.  A parallel-plate actuated test structure for fatigue analysis of MEMS , 2011, 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering.

[16]  R. Aigner,et al.  Fracture strength and fatigue of polysilicon determined by a novel thermal actuator [MEMS] , 2000 .

[17]  W. Merlijn van Spengen,et al.  MEMS reliability from a failure mechanisms perspective , 2003, Microelectron. Reliab..

[18]  K. Jackson,et al.  Tensile testing of MEMS materials—recent progress , 2003 .

[19]  Yong Qing Fu,et al.  Diamond and diamond-like carbon MEMS , 2007 .

[20]  Z. Stanimirovic,et al.  Mechanical characterization of MEMS materials , 2012, 2012 28th International Conference on Microelectronics Proceedings.

[21]  D. Hutt,et al.  Application of adhesives in MEMS and MOEMS assembly: a review , 2002, 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599).

[22]  J. Bielen,et al.  Evaluation of Creep in RF MEMS Devices , 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

[23]  Jwo Pan,et al.  Fatigue Testing and Analysis: Theory and Practice , 2004 .

[24]  A. Gasparyan,et al.  Effects of electrical leakage currents on MEMS reliability and performance , 2004, IEEE Transactions on Device and Materials Reliability.

[25]  Toshiyuki Tsuchiya,et al.  High-cycle fatigue of micromachined single crystal silicon measured using a parallel fatigue test system , 2007, IEICE Electron. Express.

[26]  B. Bhushan,et al.  Fatigue studies of nanoscale structures for MEMS/NEMS applications using nanoindentation techniques , 2003 .

[27]  Jeremy A. Walraven,et al.  Failure mechanisms in mems , 2003, International Test Conference, 2003. Proceedings. ITC 2003..

[28]  Stuart B. Brown,et al.  On the evolution of surface morphology of polysilicon MEMS structures during fatigue , 2000 .

[29]  Shangchun Fan,et al.  Research development of measuring methods on the tribology characters for movable MEMS devices: a review , 2009 .

[30]  Ping Yang,et al.  Surface sliding simulation in micro-gear train for adhesion problem and tribology design by using molecular dynamics model , 2007 .

[31]  Paul J. Mcwhorter,et al.  Materials issues in microelectromechanical devices: science, engineering, manufacturability and reliability , 2003 .

[32]  T. Ikehara,et al.  Low-Cycle to Ultrahigh-Cycle Fatigue Lifetime Measurement of Single-Crystal-Silicon Specimens Using a Microresonator Test Device , 2012, Journal of Microelectromechanical Systems.

[33]  G. X Li,et al.  Drop test and analysis on micro-machined structures , 2000 .

[34]  M. Pecht,et al.  MEMS Reliability Review , 2012, IEEE Transactions on Device and Materials Reliability.

[35]  M. Shoaib,et al.  An unconventional method for exploration of oil and gas , 2012, 2012 International Conference on Emerging Technologies.

[36]  O. Tabata,et al.  Fatigue characteristics of polycrystalline silicon thin-film membrane and its dependence on humidity , 2013 .

[37]  irwin Guttman,et al.  Introductory Engineering Statistics , 1965 .

[38]  William N. Sharpe,et al.  Fatigue of polycrystalline silicon under long-term cyclic loading , 2003 .

[39]  Willis A. Jensen.  Using the Weibull Distribution: Reliability, Modeling, and Inference , 2013 .

[40]  Sang Won Yoon,et al.  Vibration-induced errors in MEMS tuning fork gyroscopes , 2012 .

[41]  A KoellenspergerP,et al.  王水による化学ウェットエッチングによる白金(Pt)薄膜のパターン形成 , 2012 .

[42]  R. F. Bunshah,et al.  Measurement of mechanical properties , 1971 .

[43]  Robert O. Ritchie,et al.  Fatigue of polycrystalline silicon for microelectromechanical system applications: crack growth and stability under resonant loading conditions , 2004 .

[44]  Roberto Ballarini,et al.  Dynamic fatigue of silicon , 2004 .

[45]  Toshiyuki Tsuchiya,et al.  Analysis of acceleration sensitivity in MEMS tuning fork gyroscope , 2011, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.

[46]  S.B. Brown,et al.  Materials reliability in MEMS devices , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).

[47]  Peter Gumbsch,et al.  High-cycle fatigue and strengthening in polycrystalline silicon , 2008 .

[48]  Virgil Emil Ilian,et al.  Reliability accelerated tests for microsystems , 2011, Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE).

[49]  H. Newman,et al.  Lifetime Measurements on a High-Reliability RF-MEMS Contact Switch , 2008, IEEE Microwave and Wireless Components Letters.

[50]  Hong Hocheng,et al.  Frequency effects and life prediction of polysilicon microcantilever beams in bending fatigue , 2012 .

[51]  K. Sugano,et al.  Tensile-mode fatigue tests and fatigue life predictions of single crystal silicon in humidity controlled environments , 2007, 2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS).

[52]  M. Bayoumi,et al.  On integrated CMOS-MEMS system-on-chip , 2005, The 3rd International IEEE-NEWCAS Conference, 2005..

[53]  R. Ballarini,et al.  Fatigue Failure in Polysilicon Not Due to Simple Stress Corrosion Cracking , 2002, Science.

[54]  S. M. Ali,et al.  Investigation of adhesion during operation of MEMS cantilevers , 2003, SPIE MOEMS-MEMS.

[55]  O. Pierron,et al.  Notch Root Oxide Formation During Fatigue of Polycrystalline Silicon Structural Films , 2007, Journal of Microelectromechanical Systems.

[56]  M. Kaynak,et al.  Robustness and reliability of BiCMOS embedded RF-MEMS switch , 2011, 2011 IEEE 11th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems.

[57]  Olivier N. Pierron,et al.  Investigation of the low-cycle fatigue mechanism for micron-scale monocrystalline silicon films , 2010 .

[58]  A. Tounzi,et al.  Stochastic Modeling of the Pull-In Voltage in a MEMS Beam Structure , 2011, IEEE Transactions on Magnetics.

[59]  张强,et al.  Corrosion and fatigue in micro-sized Ni cantilever beams , 2007 .

[60]  Eric A. Stach,et al.  A reaction-layer mechanism for the delayed failure of micron-scale polycrystalline silicon structural films subjected to high-cycle fatigue loading , 2002 .

[61]  Frédéric Courtade,et al.  Characterization of Au/Au, Au/Ru, and Ru/Ru ohmic contacts in MEMS switches improved by a novel methodology , 2010, MOEMS-MEMS.

[62]  Guido Baeten,et al.  Improving S/N for high frequencies , 2008 .

[63]  Tsu-Jae King Liu,et al.  Design and reliability of a micro-relay technology for zero-standby-power digital logic applications , 2009, 2009 IEEE International Electron Devices Meeting (IEDM).

[64]  S. M. Spearing,et al.  Materials issues in microelectromechanical systems (MEMS) , 2000 .

[65]  C. Kim,et al.  Measurement of mechanical properties for MEMS materials , 1999 .

[66]  Franklin R. Nash,et al.  Estimating device reliability - assessment of credibility , 1992, The Kluwer international series in engineering and computer science.

[67]  Hong Hocheng,et al.  Fabrication and Fatigue Testing of an Electrostatically Driven Microcantilever Beam , 2006 .

[68]  X. J. Liang,et al.  The adhesion failure analysis of the MEMS gyroscope with comb capacitor , 2009, 2009 8th International Conference on Reliability, Maintainability and Safety.

[69]  Kaustubh Bhalerao,et al.  Reliability assessment of polysilicon MEMS structures under mechanical fatigue loading , 2003 .

[70]  C. Duvvury,et al.  ESD: a pervasive reliability concern for IC technologies , 1993 .

[71]  Jeremy A. Walraven.  Future challenges for mems failure analysis , 2003, International Test Conference, 2003. Proceedings. ITC 2003..

[72]  Michael R. Douglass,et al.  DMD reliability: a MEMS success story , 2003, SPIE MOEMS-MEMS.

[73]  J. Hung,et al.  Various Fatigue Testing of Polycrystalline Silicon Microcantilever Beam in Bending , 2008 .

[74]  João Pedro Conde,et al.  Reliability and stability of thin-film amorphous silicon MEMS resonators , 2012 .

[75]  D. P. Vallett.  Failure analysis requirements for nanoelectronics , 2002 .

[76]  Jeremy A. Walraven,et al.  MEMS reliability in shock environments , 2000, 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059).

[77]  Daniel J. Fonseca,et al.  On MEMS Reliability and Failure Mechanisms , 2011 .

[78]  Patrick Ruther,et al.  Seamless interpretation of the strength and fatigue lifetime of polycrystalline silicon thin films , 2008 .

[79]  Steven T. Patton,et al.  Performance results of MEMS coated with a conformal DLC , 2006 .

[80]  Stuart B. Brown,et al.  Surface Topology and Fatigue in Si MEMS Structures , 2001 .

[81]  Steven T. Walsh,et al.  Roadmapping a disruptive technology: A case study: The emerging microsystems and top-down nanosystems industry , 2004 .

[82]  P. Blondy,et al.  Reliability of Dielectric Less Electrostatic Actuators in RF-MEMS Ohmic Switches , 2008, 2008 European Microwave Integrated Circuit Conference.

[83]  O. Paul,et al.  Effect of humidity and temperature on the fatigue behavior of polysilicon thin film , 2011 .

[84]  Stuart B. Brown,et al.  Subcritical crack growth in silicon MEMS , 1999 .

[85]  Rong Zheng,et al.  Obstacle Discovery in Distributed Active Sensor Networks , 2009, IEEE INFOCOM 2009.

[86]  Marius Bâzu.  MEMS MANUFACTURING AND RELIABILITY , 2012 .

[87]  A. Valle,et al.  Diffusion of nuclear energy in some developing countries , 2014 .

[88]  M. Ciavarella,et al.  A generalized Paris' law for fatigue crack growth , 2006 .

[89]  Wolfgang Kuehnel,et al.  A surface micromachined silicon accelerometer with on-chip detection circuitry , 1994 .

[90]  Alberto Corigliano,et al.  A new on-chip test structure for real time fatigue analysis in polysilicon MEMS , 2009, Microelectron. Reliab..

[91]  Rohit Pathak,et al.  Distributive computing for reliability analysis of MEMS devices using MATLAB , 2009, ICAC3 '09.

[92]  Mykhaylo Lobur,et al.  Design principles and sensitivity analysis of MEMS cantilever sensors , 2010, 2010 Proceedings of VIth International Conference on Perspective Technologies and Methods in MEMS Design.

[93]  Eric A. Stach,et al.  The effects of cubic stiffness on fatigue characterization resonator performance , 2010 .

[94]  Jie-ying Tang,et al.  Modeling of MEMS reliability in shock environments , 2004, Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004..

[95]  D. Peroulis,et al.  A Numerical Fatigue Damage Model for Life Scatter of MEMS Devices , 2009, Journal of Microelectromechanical Systems.

[96]  Pranav Shrotriya,et al.  On the evolution of surface morphology of polysilicon MEMS structures during fatigue , 2004 .

[97]  Michael S. Eldred,et al.  Solution-Verified Reliability Analysis and Design of Compliant Micro-Electro-Mechanical Systems , 2007 .

[98]  Gabriel M. Rebeiz,et al.  RF MEMS switches and switch circuits , 2001 .

[99]  Hong Hocheng,et al.  Torsion Fatigue Testing of Polycrystalline Silicon Cross-Microbridge Structures , 2011 .

[100]  Wen-Ben Jone,et al.  Reliability Analysis of Self-Repairable MEMS Accelerometer , 2006, 2006 21st IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems.

[101]  T. G. Carne,et al.  Experimental modal analysis for microelectromechanical systems , 2005 .

[102]  Toshiyuki Tsuchiya,et al.  High-cycle fatigue of micromachined single-crystal silicon measured using high-resolution patterned specimens , 2008 .

[103]  R. Mullen,et al.  Electrostatically actuated failure of microfabricated polysilicon fracture mechanics specimens† , 1999, Proceedings of the Royal Society of London. Series A: Mathematical, Physical and Engineering Sciences.

[104]  B. Stark.  MEMS Reliability Assurance Guidelines for Space Applications , 1999 .

[105]  Eric A. Stach,et al.  Very high-cycle fatigue failure in micron-scale polycrystalline silicon films : Effects of environment and surface oxide thickness , 2007 .

[106]  C. D. White,et al.  A General Methodology to Predict the Reliability of Single-Crystal Silicon MEMS Devices , 2009, Journal of Microelectromechanical Systems.

[107]  Chandradip Patel,et al.  Performance and reliability of mems gyroscopes at high temperatures , 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

[108]  Tai-Ran Hsu,et al.  Reliability in MEMS Packaging , 2006, 2006 IEEE International Reliability Physics Symposium Proceedings.

[109]  Olivier N. Pierron,et al.  Highly localized surface oxide thickening on polycrystalline silicon thin films during cyclic loading in humid environments , 2009 .

[110]  Olivier N. Pierron.  Environmental contributions to fatigue failure of micron-scale silicon films used in microelectromechanical system (MEMS) devices , 2005 .

[111]  D. M. Tanner,et al.  The effect of humidity on the reliability of a surface micromachined microengine , 1999, 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296).

[112]  Irwin Guttman,et al.  Introductory Engineering Statistics , 1965 .

[113]  Pranav Shrotriya,et al.  Surface topography evolution and fatigue fracture in polysilicon MEMS structures , 2003 .

[114]  Srinivas Tadigadapa,et al.  Reliability of Microelectromechanical Systems (MEMS) , 2001 .

[115]  E. Longmire,et al.  Experimental Technique for Fatigue Testing of MEMS in Liquids , 2012, Journal of Microelectromechanical Systems.

[116]  Aurelio Soma,et al.  MEMS design for reliability: Mechanical failure modes and testing , 2011, Perspective Technologies and Methods in MEMS Design.

[117]  Robert B Abernethy,et al.  The New Weibull handbook : reliability and statistical analysis for predicting life, safety, supportability, risk, cost and warranty claims , 2004 .

[118]  Quan Sun,et al.  Stress-lifetime joint distribution model for performance degradation failure , 2011, 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering.

[119]  Jerry L. Leonard,et al.  Integration of deformable mirror devices with optical fibers and waveguides , 1993, Other Conferences.

[120]  S. Chu,et al.  Finite Element Simulation of Fatigue Crack Growth Determination of the Paris Exponent , 2011 .

[121]  Herbert Shea,et al.  MEMS Reliability , 2010 .