Effects of Rework on the Reliability of Pin Grid Array Interconnects

In this study, the reliability of solder joints and plated‐through hole copper pads/barrels of pin grid array assemblies under rework condition has been determined by fatigue experiments. The cross‐sections of the re‐worked PGA assemblies (before and after fatigue tests) are also provided for a better understanding of the failure mechanisms of the composite structure. Furthermore, the load‐drop curves of the PGA interconnects for up to three reworks are provided for a better estimate of their fatigue life.

[1]  M. A. Oien.  Methods for Evaluating Plated-Through-Hole Reliability , 1976, 14th International Reliability Physics Symposium.

[2]  M. A. Oien.  A Simple Model for the Thermo-Mechanical Deformations of Plated-Through-Holes in Multilayer Printed Wiring Boards , 1976, 14th International Reliability Physics Symposium.

[3]  F. H. Howie,et al.  Blowholing in PTH Solder Fillets: Part 1 Assessment of the Problem , 1986 .

[4]  Kenneth S. Vecchio,et al.  Analysis of long term reliability of plated-through holes in multilayer interconnection boards Part A: Stress analyses and material characterization , 1986 .

[5]  F. H. Howie,et al.  Blowholing in PTH Solder Fillets , 1986 .

[6]  F. H. Howie,et al.  Blowholing in PTH Solder Fillets: Part 2 The Nature, Origin and Evolution of the Gas , 1986 .

[7]  A. Fox.  Mechanical Properties at Elevated Temperature of CuBath® Electroplated Copper for Multilayer Boards , 1976 .

[8]  L. C. Lee,et al.  Micromechanics of multilayer printed circuit boards , 1984 .

[9]  P. J. Boddy,et al.  Accelerated Life Testing of Flexible Printed Circuits , 1976, 14th International Reliability Physics Symposium.

[11]  W. T. Chen,et al.  Optimization of interconnections between packaging levels , 1984 .

[12]  B. A. Mirman.  Mathematical model of a plated-through hole under a load induced by thermal mismatch , 1988 .

[13]  C. Lea,et al.  A scientific guide to surface mount technology , 1988 .

[14]  Che-yu Li,et al.  Assembly Stiffness and Failure Criterion Considerations in Solder Joint Fatigue , 1990 .

[15]  C. Lea,et al.  Blowholing in PTH Solder Fillets: Part 5 The Rôle of the Electroless Copper , 1986 .

[16]  H. Amann,et al.  Measurement of Thermo-Mechanical Strains in Plated-Through-Holes , 1976, 14th International Reliability Physics Symposium.

[17]  P. Engel,et al.  Principles of electronic packaging , 1989 .

[18]  C. Lea,et al.  Controlling the Quality of Soldering of PTH Solder Joints , 1985 .

[19]  F. H. Howie,et al.  Blowholing in PTH Solder Fillets: Part 8 The Scientific Framework Leading to Recommendations for Its Elimination , 1987 .

[20]  Ravichandren Shbrahmanyan.  A damage integral approach for low-cycle isothermal and thermal fatigue , 1990 .

[21]  J. H. Lau,et al.  Thermal Stress Analysis of SMT PQFP Packages and Interconnections , 1989 .

[22]  R. Munikoti,et al.  A new power cycling technique for accelerated reliability evaluation of plated-through-holes and interconnects in PCBs , 1990 .

[23]  J. Lau,et al.  Solder joint reliability of fine pitch surface mount technology assemblies , 1989, Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,.

[24]  H. Solomon.  Fatigue of 60/40 Solder , 1986 .

[25]  J. Lau,et al.  Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate , 1991 .

[26]  R. Subrahmanyan,et al.  A damage integral approach to thermal fatigue of solder joints , 1989, Proceedings., 39th Electronic Components Conference.

[27]  S. Nakahara,et al.  Microstructure and ductility of electroless copper deposits , 1983 .