A manufacturing device for semiconductor

The present invention relates to a semiconductor manufacturing device. The present invention is a jig that is provided with a slit in which the semiconductor package is mounted; The cutting blade for cutting the semiconductor package held in the said jig; Support from below the jig, and the concave grooves on the surface of the jig in contact with the chuck table is formed in plurality; is configured to include a. According to the semiconductor manufacturing apparatus according to the present invention having such a configuration, the defect rate is decreased to form a groove on the chuck table such that foreign matter is removed automatically by to collect debris generated by the cutting of the semiconductor package there is an advantage in productivity increase. Chuck table, a jig, a semiconductor package, the home