Emerging microwave packaging technologies

Microwave and millimeter wave Multi-Chip assembly (MCA) packaging is an emerging technology that is of great importance to both defense and commercial applications. An ARPA/Tri-Service program entitled "High density microwave packaging (HDMP)" was initiated in late FY93. The objectives are to develop suitable designs, materials, and manufacturing processes to produce affordable, multi-chip assemblies and sub-arrays. The status of the program is reviewed.