The effect of pulse reversal on morphology of cobalt hard gold

[1]  Leo M.L. Nollet,et al.  Handbook of Water Analysis , 2013 .

[2]  A. West,et al.  Electrochemical Quartz Crystal Microbalance Studies of Gold Oxidation in Cyanide Baths , 2011 .

[3]  A. West,et al.  Effect of Morphology and Hydrogen Evolution on Porosity of Electroplated Cobalt Hard Gold , 2010 .

[4]  M. Nagao,et al.  Effect of Reverse Pulse on Copper Fill , 2009 .

[5]  A. West,et al.  Effect of additives and pulse plating on copper nucleation onto Ru , 2009 .

[6]  H. Hertz,et al.  Pulse reverse plating for uniform nickel height in zone plates , 2006 .

[7]  T. Dinan.  Metrology errors in the use of insulating dots for plated thickness measurements , 2003 .

[8]  M. Aroyo,et al.  Pulse periodic reverse plating: New possibilities for electrodeposition of metal coatings with improved properties: Part 1 , 2002 .

[9]  Y. Okinaka.  Significance of inclusions in electroplated gold films for electronics applications , 2000 .

[10]  A. West,et al.  Pulse Reverse Copper Electrodeposition in High Aspect Ratio Trenches and Vias , 1998 .

[11]  D. Landolt,et al.  Determination of the practical range of parameters during reverse-pulse current plating , 1997 .

[12]  A. Lasia,et al.  Nucleation and crystal growth in gold electrodeposition from acid solution Part I: Soft gold , 1996 .

[13]  I. Christie,et al.  Gold electrodeposition within the electronics industry , 1994 .

[14]  D. Gabe,et al.  Porosity of Electrodeposited Coatings: Its Cause, Nature, Effect and Management , 1992 .

[15]  N. Spyrellis,et al.  Influence of pulse reversed current technique on the crystalline orientation and surface morphology of nickel electrodeposits , 1991 .

[16]  J. K. Dennis,et al.  Effect of pulsed reverse current on the structure and hardness of copper deposits obtained from acidic electrolytes containing organic additives , 1990 .

[17]  J. K. Dennis,et al.  The effect of pulsed reverse current on the polarization behaviour of acid copper plating solutions containing organic additives , 1990 .

[18]  James R. White.  Reverse pulse plating of copper from acid electrolyte: A rotating ring disc electrode study , 1987 .

[19]  S. Nakahara.  On the growth morphology of hard gold electrodeposits , 1986 .

[20]  L. Sjögren,et al.  Properties of nickel-hardened gold plated with low-frequency periodic reverse current , 1986 .

[21]  M. Maksimović,et al.  Fundamental aspects of pulsating current metal electrodeposition VI: The comparison of electrode surface roughening in pulsating current and periodic reverse current electrodeposition of metals , 1982 .

[22]  M. Maksimović,et al.  The effect of periodic reverse current on the surface roughness of metal deposits and the maximal deposition rate , 1982 .

[23]  F. R. Foulkes,et al.  A Study of Anodic Dissolution of Gold in Aqueous Alkaline Cyanide , 1978 .

[24]  E. Eisenmann.  Kinetics of the Electrochemical Reduction of Dicyanoaurate , 1978 .

[25]  D. M. Arthur.  A Study of Gold Reduction and Oxidation in Aqueous Solutions , 1972 .

[26]  Huk Y. Cheh.  The Limiting Rate of Deposition by P‐R Plating , 1971 .

[27]  Huk Y. Cheh.  Electrodeposition of Gold by Pulsed Current , 1971 .