Design of a Low-Noise UWB Transceiver SiP

Ultrawideband (UWB) wireless communication systems are emerging as a promising solution for high-data-rate and short-distance wireless data transmission. In this article, we introduce a low-noise UWB transceiver SiP design for a compact implementation in a small mobile platform. The SiP's transmitter chip has a fully digital circuit implementation with a passive band-pass filter to meet a US Federal Communications Commission (FCC) regulation, and the receiver chip has a noncoherent architecture. To reduce noise generation and coupling in the densely integrated design, we considered signal integrity issues in the high-frequency channel and power integrity issues on the power distribution network (PDN) in the SiP substrate. Circuit-level and full-wave simulations confirm that the proposed design methodology improves signal integrity and power integrity. The UWB transceiver SiP consists of a fully digital transmitter system and a noncoherent receiver system.

[1]  Joungho Kim,et al.  System-on-package ultra-wideband transmitter using CMOS impulse generator , 2006, IEEE Transactions on Microwave Theory and Techniques.

[2]  Joungho Kim,et al.  Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array , 2006, IEEE Design & Test of Computers.

[3]  K MadisettiVijay,et al.  System on Chip or System on Package , 1999 .

[4]  Eric Bogatin Signal Integrity - Simplified , 2003 .

[5]  J. Mayer Advanced packaging , 1986 .

[6]  A. Rabbachin,et al.  Front-end receiver for low power, low complexity non-coherent UWB communications system , 2005, 2005 IEEE International Conference on Ultra-Wideband.

[7]  R.R. Tummala,et al.  SOP: what is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade , 2004, IEEE Transactions on Advanced Packaging.

[8]  Joungho Kim,et al.  System-on-Package Ultra Wideband Transmitter with Integrated Bandpass Filter and Broad Band Planar Antenna , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

[9]  Joungho Kim,et al.  Noise coupling to signal trace and via from power/ground simultaneous switching noise in high speed double data rates memory module , 2004, 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559).

[10]  Joungho Kim,et al.  Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system , 2003, Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710).

[11]  Joungho Kim,et al.  Design of LTCC-based ultra-wideband transmitter SiP using CMOS impulse generator , 2006, 2006 8th Electronics Packaging Technology Conference.

[12]  Joungho Kim,et al.  Modeling and Measurement of Radiated Field Emission From a Power/Ground Plane Cavity Edge Excited by a Through-Hole Signal Via Based on a Balanced TLM and Via Coupling Model , 2007, IEEE Transactions on Advanced Packaging.