Gate oxide thickness dependence of RIE-induced damages on n-channel MOSFET reliability

We have investigated the effect of gate oxide thickness scaling on RIE-induced damage in n-MOSFETs. Our results show that active damage to gate oxide increases as the thickness is scaled down. On the other hand, thinner gate oxide devices show smaller degradation under hot carrier as well as Fowler-Nordheim stress compared to thicker gate oxide devices for a given antenna type and ratio. Reduced degradation in thinner oxide MOSFETs is explained based on smaller mobility degradation as well as on higher amount of channel inversion charge.

[1]  Koji Eriguchi,et al.  Evaluation technique of gate oxide damage , 1994 .

[2]  R. Rakkhit,et al.  Process induced oxide damage and its implications to device reliability of submicron transistors , 1993, 31st Annual Proceedings Reliability Physics 1993.

[3]  C. Viswanathan,et al.  Reappearance of plasma induced oxide charge under Fowler-Nordheim stress , 1994 .

[4]  Chenming Hu,et al.  Thickness and other effects on oxide and interface damage by plasma processing , 1993, 31st Annual Proceedings Reliability Physics 1993.

[5]  C. Hu,et al.  Thin oxide charging current during plasma etching of aluminum , 1991, IEEE Electron Device Letters.

[6]  Hiroshi Iwai,et al.  Analysis on gate-oxide thickness dependence of hot-carrier-induced degradation in thin-gate oxide nMOSFET's , 1990 .

[7]  S. Aur,et al.  High density plasma etch induced damage to thin gate oxide , 1995, Proceedings of International Electron Devices Meeting.

[8]  K. Noguchi,et al.  Modeling oxide thickness dependence of charging damage by plasma processing , 1993, IEEE Electron Device Letters.

[9]  K.P. Cheung An efficient method for plasma-charging damage measurement , 1994, IEEE Electron Device Letters.

[10]  J. McVittie,et al.  Thin-oxide damage from gate charging during plasma processing , 1992, IEEE Electron Device Letters.

[11]  B. S. Doyle,et al.  Effect of plasma-induced charging damage on n-channel and p-channel MOSFET hot carrier reliability , 1994, Proceedings of 1994 IEEE International Reliability Physics Symposium.

[12]  C. Hu,et al.  Dependence of plasma-induced oxide charging current on Al antenna geometry , 1992, IEEE Electron Device Letters.

[13]  J. McVittie,et al.  A model and experiments for thin oxide damage from wafer charging in magnetron plasmas , 1992, IEEE Electron Device Letters.

[14]  Chenming Hu,et al.  Effect of low and high temperature anneal on process-induced damage of gate oxide , 1994, IEEE Electron Device Letters.

[15]  B. Riccò,et al.  High-field-induced degradation in ultra-thin SiO/sub 2/ films , 1988 .

[16]  Dim-Lee Kwong,et al.  Suppressed Process-Induced Damage in N2O-annealed SiO2 Gate Dielectrics , 1995 .

[17]  R. Chau,et al.  Correlation of plasma process induced charging with Fowler-Nordheim stress in p- and n-channel transistors , 1992, 1992 International Technical Digest on Electron Devices Meeting.