CMOS-on-LTCC integrated fingertip sensor with 3-axis tactile and thermal sensation for robots
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[1] M. Esashi,et al. Wafer-level hermetic packaging technology for MEMS using anodically-bondable LTCC wafer , 2011, 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems.
[2] Leandro Lorenzelli,et al. POSFET Tactile Sensing Arrays using CMOS Technology , 2013 .
[3] Young-Ho Kim,et al. Review paper: Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA) , 2013 .
[4] Yutaka Nonomura,et al. 3-Axis fully-integrated surface-mountable differential capacitive tactile sensor by CMOS flip-bonding , 2016, 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS).
[5] Makoto Ishida,et al. A multifunctional integrated silicon tactile imager with arrays of strain and temperature sensors on single crystal silicon diaphragm , 2010 .
[6] Gordon Cheng,et al. Directions Toward Effective Utilization of Tactile Skin: A Review , 2013, IEEE Sensors Journal.
[7] F. Kreith,et al. Principles of heat transfer , 1962 .
[8] Yutaka Nonomura,et al. A multiple sensor platform with dedicated CMOS-LSIs for robot applications , 2016, 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS).