Modeling of the surface temperature field of a thermoelectric radiant ceiling panel system

Thermoelectric radiant ceiling panel system (TE-RCP) is a novel and promising system which combines the advantages of thermoelectric cooling/heating and conventional radiant ceiling panel system. The experimental investigations and case studies of TE-RCP have been carried out. But there is short of theoretical analysis and heat transfer model to provide a basis for the deeper and further investigation about TE-RCP. By solving the governing equation of the TE-RCP and using virtual heat source method to simulate the boundary conditions, the surface temperature field of TE-RCP under constant heat source intensity can be calculated. The dynamic-state model under variable heat source intensity is developed by adopting the idea of superposition principle and step load theory. The calculated temperature on the surface of radiant panel and hot/cold side of TE modules are in agreement with the experimental values. A system coefficient of performance (COP) is proposed based on the steady state model of TE-RCP to analyze the impact of working current of TE modules on the system performance. The simulations indicate that in cooling mode the system cooling capacity ranges between 48.6W/m2 and 104.1W/m2 and the corresponding system COP ranges between 1.06 and 2.29 under the working current from 1A to 2A. In heating mode, the system heating capacity ranges between 165.6W/m2 and 343W/m2 and the corresponding system COP ranges between 1.51 and 1.8 under the working current from 2A to 3A. This proposed model can provide a solid foundation for the further design, optimization, and system control of TE-RCP.

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