Method and apparatus of aligning a substrate, and method and apparatus of inspecting a pattern on a substrate using the same

According to the substrate alignment method, it obtains a new marked image from the alignment marks on the substrate to perform a semiconductor process. And compares the new mark image and the reference image from a predetermined alignment marks before the step. Then, according to the comparison result, so as to align the substrate alignment mark corresponds to a reference image or a new marked image. Accordingly, the number of so optionally use a reference image in the subsequent sorting process, the sorting time is significantly reduced.