Apparatus and methods for constructing antennas using wire bonds as radiating elements

Using the one or more wires attached to the substrate or chip as the radiating element there is provided an antenna configured, in which there is a wire-bonding method may be used to attach the loop profiles for the wires is formed. The antenna can be completely packaged with an IC chip (e.g., IC transceiver, receiver, transmitter, etc.), configuring the integrated wireless or RF (radio frequency) communications system. For example, an exemplary antenna device 20 is the connected and carried by the first wire element 22, the metal pads 26 and 27 are connected and carried by the metal pads 23 and 24 2 includes a substrate having a dipole antenna comprises a wire element (25). Metal pads 23 and 26 is, for example, the contact pads on the integrated antenna feed network connected to the RF circuit. Metal pads 24 and 27 is a sectional pads for attaching and supporting portion end (non-feed) of each of the wire elements 22 and 25. Selective metal shielding element (28) and (29) are formed on the substrate / chip (21) under each of the wire elements 22 and 25, the loss by preventing the electromagnetic field passes through the substrate 21, and reducing the improved antenna efficiency.