Singular Stokes-polarimetry as new technique for metrology and inspection of polarized speckle fields

Polarimetry is effective technique for polarized light fields characterization. It was shown recently that most full “finger-print” of light fields with arbitrary complexity is network of polarization singularities: C points with circular polarization and L lines with variable azimuth. The new singular Stokes-polarimetry was elaborated for such measurements. It allows define azimuth, eccentricity and handedness of elliptical vibrations in each pixel of receiving CCD camera in the range of mega-pixels. It is based on precise measurement of full set of Stokes parameters by the help of high quality analyzers and quarter-wave plates with λ/500 preciseness and 4’ adjustment. The matrices of obtained data are processed in PC by special programs to find positions of polarization singularities and other needed topological features. The developed SSP technique was proved successfully by measurements of topology of polarized speckle-fields produced by multimode “photonic-crystal” fibers, double side rubbed polymer films, biomedical samples. Each singularity is localized with preciseness up to ± 1 pixel in comparison with 500 pixels dimensions of typical speckle. It was confirmed that network of topological features appeared in polarized light field after its interaction with specimen under inspection is exact individual “passport” for its characterization. Therefore, SSP can be used for smart materials characterization. The presented data show that SSP technique is promising for local analysis of properties and defects of thin films, liquid crystal cells, optical elements, biological samples, etc. It is able discover heterogeneities and defects, which define essentially merits of specimens under inspection and can’t be checked by usual polarimetry methods. The detected extra high sensitivity of polarization singularities position and network to any changes of samples position and deformation opens quite new possibilities for sensing of deformations and displacement of checked elements in the sub-micron range.

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