论文信息 - Demonstration of a Ce: YIG/SOI isolator bt BCB bonding

Demonstration of a Ce: YIG/SOI isolator bt BCB bonding

We demonstrate an optical isolator on a Silicon-on-insulator platform realized by adhesive BCB bonding. A Ce:YIG die was manually bonded on top of a Mach-Zehnder interferometer (MZI) using a 100nm thick BCB bonding layer. Experimentally a maximum isolation of 25dB was obtained. The insertion loss of the bonded device is about 8dB. The nonreciprocal phase shift (NRPS) induced by the Ce:YIG with the aid of an external magnetic field matches with simulation. The simulation, design and experimental results are presented in this paper.

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