A multi-chip directly mounted 512 MEMS mirror array module with hermetically sealed package for large optical cross-connects

A 512 MEMS mirror array module with a hermetically sealed package for large optical cross-connects is constructed by using newly developed multi-chip direct mounting (MCDM) technology and is demonstrated to enable a plusmn5 degree rotation of the two-axis stationary operation under a drive voltage of 160 V, while having a high resonance frequency of 2 kHz

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