A hybrid high-speed silica-based planar lightwave circuit platform integrating a laser diode and a driver IC

We have developed silica-based planar lightwave circuit platform by integrating an LD array and a two-channel LD driver IC operating at 9 Gb/s. The combination of AuSn and In solder bumps enabled the flip-chip bonding of the LD array and the driver IC on the same platform.