Transfer of thin Au films to polydimethylsiloxane (PDMS) with reliable bonding using (3-mercaptopropyl)trimethoxysilane (MPTMS) as a molecular adhesive

This paper describes the transfer of thin gold films deposited on rigid silicon substrates to polydimethylsiloxane (PDMS) with reliable and strong bonding. Modification of the Au surfaces with (3-mercaptopropyl)trimethoxysilane (MPTMS) as a molecular adhesive was carried out to promote adhesion between Au and PDMS. The degree of bonding with respect to the concentration of MPTMS, treatment time and methods of deposition was investigated by a simple adhesion test using two different adhesive tapes. The effect of hydrolysis of MPTMS is discussed based on the bonding mechanism of MPTMS to the PDMS prepolymer. Also, the adsorption of MPTMS on Au deposited by different methods is discussed. The results indicate that liquid deposition of MPTMS provides the strongest adhesion between Au and PDMS among the different deposition methods and the different linker molecules. Based on these studies, the Au patterns with linewidth of less 2 μm were successfully transferred to PDMS with reliable and strong bonding in a full 3 inch wafer scale, using a dry peel-off process. (Some figures may appear in colour only in the online journal)

[1]  Yonggang Huang,et al.  Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations , 2008, Proceedings of the National Academy of Sciences.

[2]  Y. Yamaguchi,et al.  Structure and morphology of self-assembled 3-mercaptopropyltrimethoxysilane layers on silicon oxide , 2001 .

[3]  Yonggang Huang,et al.  Materials and Mechanics for Stretchable Electronics , 2010, Science.

[4]  Jaeho Kim,et al.  Low-temperature graphene synthesis using microwave plasma CVD , 2013 .

[5]  Jagdeep Singh,et al.  Adsorption of 3-Mercaptopropyltrimethoxysilane on Silicon Oxide Surfaces and Adsorbate Interaction with Thermally Deposited Gold , 2008 .

[6]  Fabrication and characterization of a molecular adhesive layer for micro- and nanofabricated electrochemical electrodes , 2003 .

[7]  Teri W Odom,et al.  Large-area nanocontact printing with metallic nanostencil masks. , 2010, Angewandte Chemie.

[8]  J. Harrison,et al.  Packing-Density Effects on the Friction of n-Alkane Monolayers , 2001 .

[9]  Jiango Li,et al.  Interfacial Properties and Tribological Behavior of 3-Mercaptopropyltrimethoxysilane Self-Assemble Film , 2012 .

[10]  B. Kolbesen,et al.  A comparative study of the growth of octadecyltrichlorosilane and 3-mercaptopropyltrimethoxysilane self-assembled monolayers on hydrophilic silicon surfaces , 2008 .

[11]  John A Rogers,et al.  A photocurable poly(dimethylsiloxane) chemistry designed for soft lithographic molding and printing in the nanometer regime. , 2003, Journal of the American Chemical Society.

[12]  N. Jaffrezic‐Renault,et al.  Use of ultra-thin organic silane films for the improvement of gold adhesion to the silicon dioxide wafers for (bio)sensor applications , 2008 .

[13]  Koray Aydin,et al.  Highly strained compliant optical metamaterials with large frequency tunability. , 2010, Nano letters.

[14]  S. Lacour,et al.  Stretchable gold conductors embedded in PDMS and patterned by photolithography: fabrication and electromechanical characterization , 2010 .

[15]  H. Fujita,et al.  Fabrication of metallic microstructure on curved substrate by optical soft lithography and copper electroplating , 2011 .

[16]  J. Rogers,et al.  Additive, nanoscale patterning of metal films with a stamp and a surface chemistry mediated transfer process: Applications in plastic electronics , 2002 .

[17]  Rashid Bashir,et al.  Reliable fabrication method of transferable micron scale metal pattern for poly(dimethylsiloxane) metallization. , 2006, Lab on a chip.

[18]  Xiaolin Zheng,et al.  Fabricating nanowire devices on diverse substrates by simple transfer-printing methods , 2010, Proceedings of the National Academy of Sciences.

[19]  G. Whitesides,et al.  Formation of monolayer films by the spontaneous assembly of organic thiols from solution onto gold , 1989 .

[20]  C. Halliwell,et al.  A factorial analysis of silanization conditions for the immobilization of oligonucleotides on glass surfaces. , 2001, Analytical chemistry.

[21]  Ralph G Nuzzo,et al.  Large-area patterning of coinage-metal thin films using decal transfer lithography. , 2005, Langmuir : the ACS journal of surfaces and colloids.

[22]  M. Ho,et al.  Hydrolysis and Condensation of Self-Assembled Monolayers of (3-Mercaptopropyl)trimethoxysilane on Ag and Au Surfaces , 1997 .

[23]  S. Wagner,et al.  Controlling the morphology of gold films on poly(dimethylsiloxane). , 2010, ACS applied materials & interfaces.

[24]  Sung-hoon Ahn,et al.  A flexible and highly sensitive strain-gauge sensor using reversible interlocking of nanofibres. , 2012, Nature materials.

[25]  C. Goss,et al.  Application of (3-mercaptopropyl)trimethoxysilane as a molecular adhesive in the fabrication of vapor-deposited gold electrodes on glass substrates , 1991 .

[26]  J. A. Augis,et al.  The hardness and ductility of sputtered gold films , 1979 .

[27]  Audrey M. Bowen,et al.  Fabrication of Flexible Binary Amplitude Masks for Patterning on Highly Curved Surfaces , 2009 .

[28]  M. Linford,et al.  Back-Surface Gold Mirrors for Vibrationally Resonant Sum-Frequency (VR-SFG) Spectroscopy Using 3-Mercaptopropyltrimethoxysilane as an Adhesion Promoter , 2011, Applied spectroscopy.

[29]  Benjamin C. K. Tee,et al.  Highly sensitive flexible pressure sensors with microstructured rubber dielectric layers. , 2010, Nature materials.

[30]  Ralph G. Nuzzo,et al.  Fabrication of Stable Metallic Patterns Embedded in Poly(dimethylsiloxane) and Model Applications in Non‐Planar Electronic and Lab‐on‐a‐Chip Device Patterning , 2005 .

[31]  K. Suh,et al.  Physical Self-Assembly of Microstructures by Anisotropic Buckling , 2002 .

[32]  George M. Whitesides,et al.  Spontaneous formation of ordered structures in thin films of metals supported on an elastomeric polymer , 1998, Nature.

[33]  M. Dokmeci,et al.  Flexible Plasmonics on Unconventional and Nonplanar Substrates , 2011, Advanced materials.