Electronic Prognostics Through Advanced Modeling Techniques
暂无分享,去创建一个
[1] John H. L. Pang,et al. Low cycle fatigue models for lead-free solders , 2004 .
[2] Kelly Lucile Stinson-Bagby,et al. Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints , 2002 .
[3] B.A. Zahn,et al. Solder joint fatigue life model methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu materials , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..
[4] Robert G. Tryon,et al. Probabilistic Mesomechanical Fatigue Model , 1997 .
[5] Masazumi Amagai,et al. Characterization of chip scale packaging materials , 1999 .
[6] R. Tryon,et al. Material simulation-based electronic device prognosis , 2005, 2005 IEEE Aerospace Conference.
[7] J. Lau,et al. Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies , 1996 .
[8] T. A. Cruse,et al. Probabilistic Mesomechanical Fatigue Crack Nucleation Model , 1997 .