论文信息 - Electronic Prognostics Through Advanced Modeling Techniques

Electronic Prognostics Through Advanced Modeling Techniques

Electronic prognostics is a growing field important to both military and commercial applications. When implemented, this capability will greatly enhance the maintenance management of platforms. Electronic prognostics require extensive use of physics of failure models to predict the remaining useful life of complex electronic failure modes.

J.K. Line | A. Iyer | Arun Shankar Iyer | J. Line

[1] John H. L. Pang,et al. Low cycle fatigue models for lead-free solders , 2004 .

[2] Kelly Lucile Stinson-Bagby,et al. Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints , 2002 .

[3] B.A. Zahn,et al. Solder joint fatigue life model methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu materials , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[4] Robert G. Tryon,et al. Probabilistic Mesomechanical Fatigue Model , 1997 .

[5] Masazumi Amagai,et al. Characterization of chip scale packaging materials , 1999 .

[6] R. Tryon,et al. Material simulation-based electronic device prognosis , 2005, 2005 IEEE Aerospace Conference.

[7] J. Lau,et al. Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies , 1996 .

[8] T. A. Cruse,et al. Probabilistic Mesomechanical Fatigue Crack Nucleation Model , 1997 .