Thermal Design and Optimization of a Microchannel Cooled Integrated Power Electronic Module
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This paper presents thermal evaluations of an Insulated Gate Bipolar Transistor (IGBT) integrated power electronics module (IPEM) using embedded single-phase laminar-flow rectangular microchannels. IPEMs are multi-layered structures based on embedded power technology and offer the advantage of three-dimensional (3D) packaging of electronic components in a small and compact volume, replacing the traditional wire bonding technology. However, placing multiple heat generating chips in a small volume also makes thermal management more challenging. Microchannels offer an attractive cooling approach because of their compactness and high heat transfer rate. The overall goal here was to find the optimal channel cooling configuration in the IPEM by evaluating the effect of channel layout, channel dimensions and the coolant flow rate. Moreover, a double-sided cooling approach is proposed, where channels are embedded on both top and bottom layers of the IPEM. A commercially available finite element package was used to create a 3D geometric layout of the electronic module and perform thermal evaluations using forced liquid cooling with water as the coolant. A baseline finite element numerical model was validated using experiments. The results of these studies were designs for achieving best cooling performance of the IPEM.
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